XCV800-6FG676C
- Mfr.Part #
- XCV800-6FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 444 I/O 676FCBGA
- Stock
- 43,184
- In Stock :
- 43,184
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Qualification Status :
- Not Qualified
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Lead Free :
- Contains Lead
- Package / Case :
- 676-BBGA, FCBGA
- Number of I/O :
- 444
- Number of LABs/CLBs :
- 4704
- Terminal Pitch :
- 1mm
- JESD-30 Code :
- S-PBGA-B676
- Length :
- 27mm
- Base Part Number :
- XCV800
- Combinatorial Delay of a CLB-Max :
- 0.6 ns
- Series :
- Virtex®
- Supply Voltage :
- 2.5V
- Number of Terminations :
- 676
- ECCN Code :
- EAR99
- RoHS Status :
- Non-RoHS Compliant
- Packaging :
- Tray
- Number of Outputs :
- 444
- HTS Code :
- 8542.39.00.01
- Pin Count :
- 676
- Voltage - Supply :
- 2.375V~2.625V
- Mounting Type :
- Surface Mount
- Published :
- 2000
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Inputs :
- 444
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- 225
- Width :
- 27mm
- Height Seated (Max) :
- 2.6mm
- Mount :
- Surface Mount
- Total RAM Bits :
- 114688
- Pbfree Code :
- No
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Clock Frequency :
- 333MHz
- RAM Size :
- 14kB
- Reach Compliance Code :
- not_compliant
- Number of Gates :
- 888439
- Operating Temperature :
- 0°C~85°C TJ
- JESD-609 Code :
- e0
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Logic Elements/Cells :
- 21168
- Power Supplies :
- 1.2/3.62.5V
- Datasheets
- XCV800-6FG676C

FPGAs AMD Xilinx XCV800-6FG676C Overview
The FPGAs AMD Xilinx XCV800-6FG676C is a high-performance, field-programmable gate array that is designed to meet the rigorous demands of modern digital circuits. This IC offers a flexible solution for a wide range of applications, featuring a robust 676-pin flip-chip ball grid array (FCBGA) package that supports a plethora of I/O options with 444 programmable I/O pins. Engineered by AMD Xilinx, a leader in digital design and integration, the XCV800-6FG676C provides the scalability and adaptability required for complex digital processing tasks, making it ideal for designers seeking a mixture of high-speed performance and significant logic capacity.
XCV800-6FG676C Features
This FPGA boasts a substantial array of features suitable for intensive and multifaceted digital tasks. Key features include its expansive I/O capabilities which facilitate versatile connections and interoperability with a wide array of devices and systems. Furthermore, the device's 676FCBGA packaging ensures robust physical integration and reliability, critical for high-density circuit designs where space and thermal management are paramount.
XCV800-6FG676C Applications
- Telecommunications Equipment: Utilized in routers and switches, the XCV800-6FG676C manages data flow efficiently, ensuring high-speed data transmission and reliability in network infrastructure.
- Consumer Electronics: Applied in devices such as high-definition televisions and gaming consoles, this FPGA helps in processing complex visual and audio data streams, enhancing user experience through improved performance and features.
- Automotive Systems: In automotive applications, the XCV800-6FG676C supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors rapidly, aiding in safer driving dynamics.
- Industrial Automation: Essential in the control systems of automated production lines, this FPGA streamlines operations by allowing customizable logic solutions that adapt to varied manufacturing processes.
- Aerospace and Defense: Used in avionics and military hardware, it ensures robust, secure communications and control systems critical for mission-critical operations.
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