XCV50E-7FG256C

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Mfr.Part #
XCV50E-7FG256C
Manufacturer
AMD Xilinx
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 176 I/O 256FBGA
Stock
10,615
In Stock :
10,615

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
HTS Code :
8542.39.00.01
Radiation Hardening :
No
Terminal Position :
BOTTOM
Number of I/O :
176
ECCN Code :
EAR99
Height Seated (Max) :
2mm
Published :
2006
Time@Peak Reflow Temperature-Max (s) :
30
Combinatorial Delay of a CLB-Max :
0.42 ns
Voltage - Supply :
1.71V~1.89V
Terminal Pitch :
1mm
Mount :
Surface Mount
Clock Frequency :
400MHz
Terminal Form :
Ball
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
Non-RoHS Compliant
Total RAM Bits :
65536
Number of CLBs :
384
Pin Count :
256
Supply Voltage :
1.8V
Pbfree Code :
No
Lead Free :
Contains Lead
Number of Terminations :
256
Series :
Virtex®-E
Packaging :
Tray
Speed Grade :
7
RAM Size :
8kB
Package / Case :
256-BGA
JESD-609 Code :
e0
Peak Reflow Temperature (Cel) :
225
Base Part Number :
XCV50E
Number of LABs/CLBs :
384
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mounting Type :
Surface Mount
Number of Pins :
256
Operating Temperature :
0°C~85°C TJ
Number of Outputs :
176
Number of Gates :
71693
Number of Logic Elements/Cells :
1728
Operating Supply Voltage :
1.8V
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV50E-7FG256C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:256, Package / Case:256-BGA, Base Part Number:XCV50E, Mounting Type:Surface Mount, Number of Pins:256, Operating Temperature:0°C~85°C TJ, XCV50E-7FG256C pinout, XCV50E-7FG256C datasheet PDF, XCV50E-7FG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV50E-7FG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV50E-7FG256C


FPGAs AMD Xilinx XCV50E-7FG256C Overview

The AMD Xilinx XCV50E-7FG256C is a high-performance Field Programmable Gate Array (FPGA) designed to meet the demanding needs of modern technology applications. With a robust architecture and advanced features, this FPGA provides a scalable solution that can be tailored to a variety of complex digital circuits. Its flexibility and adaptability make it ideal for designers looking to integrate a single chip with abundant logic resources and high I/O capability into their products. The XCV50E-7FG256C is especially useful in scenarios requiring swift product iterations and updates, offering both cost efficiency and time-to-market advantages.

XCV50E-7FG256C Features

The XCV50E-7FG256C FPGA offers a range of notable features including a total of 176 input/output pins housed in a compact 256FBGA package. This chip is designed for enhanced performance with a 7-series FPGA architecture, which ensures efficient handling of complex algorithms and processes. It supports various logic configurations, enabling highly customizable designs suited to specific needs. This flexibility is complemented by its high-speed data processing capabilities and low power consumption, making it an excellent choice for power-sensitive applications.

XCV50E-7FG256C Applications

  • Data Processing: Utilized in server farms and data centers, the XCV50E-7FG256C enhances data processing capabilities, facilitating faster and more reliable data throughput.
  • Telecommunications: Deployed in telecommunications infrastructure, this FPGA supports complex signal processing tasks essential for modern telecom networks.
  • Industrial Automation: In industrial settings, the XCV50E-7FG256C is key to controlling machinery and processes, improving efficiency and reliability in automation systems.
  • Medical Devices: Applied in medical diagnostic equipment, it allows for rapid and accurate processing of medical data, aiding in quicker diagnostics and treatment planning.
  • Aerospace and Defense: Used in aerospace systems, the FPGA supports navigation and control systems, contributing to enhanced safety and performance in challenging environments.
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