XCV50-4FG256C

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Mfr.Part #
XCV50-4FG256C
Manufacturer
AMD Xilinx
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 176 I/O 256FBGA
Stock
48,605
In Stock :
48,605

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Inputs :
176
Power Supplies :
1.2/3.62.5V
JESD-609 Code :
e0
Peak Reflow Temperature (Cel) :
225
Operating Temperature :
0°C~85°C TJ
Time@Peak Reflow Temperature-Max (s) :
30
Mounting Type :
Surface Mount
Total RAM Bits :
32768
HTS Code :
8542.39.00.01
Terminal Position :
BOTTOM
Length :
17mm
Number of LABs/CLBs :
384
RoHS Status :
Non-RoHS Compliant
Clock Frequency :
250MHz
Number of Gates :
57906
Lead Free :
Contains Lead
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mount :
Surface Mount
Terminal Finish :
Tin/Lead (Sn63Pb37)
JESD-30 Code :
S-PBGA-B256
Number of I/O :
176
Terminal Pitch :
1mm
Combinatorial Delay of a CLB-Max :
0.8 ns
Qualification Status :
Not Qualified
Number of Logic Elements/Cells :
1728
Number of Outputs :
176
Supply Voltage :
2.5V
Number of CLBs :
384
Packaging :
Tray
Series :
Virtex®
Published :
2000
Pin Count :
256
Pbfree Code :
No
ECCN Code :
EAR99
Terminal Form :
Ball
Height Seated (Max) :
2mm
Number of Terminations :
256
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RAM Size :
4kB
Package / Case :
256-BGA
Voltage - Supply :
2.375V~2.625V
Width :
17mm
Base Part Number :
XCV50
Reach Compliance Code :
not_compliant
Datasheets
XCV50-4FG256C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV50-4FG256C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Number of Terminations:256, Package / Case:256-BGA, Base Part Number:XCV50, XCV50-4FG256C pinout, XCV50-4FG256C datasheet PDF, XCV50-4FG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV50-4FG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV50-4FG256C


FPGAs AMD Xilinx XCV50-4FG256C Overview

The AMD Xilinx XCV50-4FG256C is a highly capable FPGA from the renowned manufacturer, specifically designed to meet the evolving demands of modern digital circuits. This device encapsulates the core strengths of FPGA technology, allowing for high levels of customization and flexibility. The XCV50-4FG256C is engineered to optimize system performance across a broad range of applications, providing a robust solution for designers seeking to enhance system speed and efficiency. Its 256FBGA packaging ensures a compact form factor, making it ideal for applications where space is at a premium. The integration of 176 I/O ports allows for extensive connectivity options, bolstering its utility in complex digital environments.

XCV50-4FG256C Features

This FPGA is equipped with a plethora of features that make it an excellent choice for both complex and straightforward applications. It offers a flexible logic optimization feature, high-performance clock management, and advanced security protocols for data protection. Additionally, its ability to be reprogrammed on-the-fly enables designers to update the FPGA without halting the system, providing significant advantages in terms of adaptability and maintenance.

XCV50-4FG256C Applications

  • Telecommunications: Utilized in routing and switching applications, enhancing signal integrity and speed.
  • Automotive: Employs in driver assistance systems, improving real-time processing capabilities.
  • Consumer Electronics: Applied in smart home devices, offering flexible integration and enhanced functionality.
  • Industrial: Used in control systems, providing robust processing power and reliability under various environmental conditions.
  • Medical Devices: Integral to diagnostic and imaging equipment, ensuring precise operation and responsiveness.
This HTML content provides a structured, keyword-optimized overview, feature description, and applications list for the AMD Xilinx XCV50-4FG256C FPGA, tailored to attract B2B clients and highlight the product's versatility and advanced capabilities in various high-demand scenarios.
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