XCV50E-6FG256C
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- Mfr.Part #
- XCV50E-6FG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 176 I/O 256FBGA
- Stock
- 39,154
- In Stock ：
- 39,154
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Gates :
- 71693
- Pbfree Code :
- No
- ECCN Code :
- EAR99
- RAM Size :
- 8kB
- Number of Terminations :
- 256
- Length :
- 17mm
- Packaging :
- Tray
- Combinatorial Delay of a CLB-Max :
- 0.47 ns
- Number of Outputs :
- 176
- Package / Case :
- 256-BGA
- JESD-609 Code :
- e0
- Number of Pins :
- 256
- Base Part Number :
- XCV50E
- Published :
- 2006
- Radiation Hardening :
- No
- Supply Voltage :
- 1.8V
- Series :
- Virtex®-E
- RoHS Status :
- Non-RoHS Compliant
- Total RAM Bits :
- 65536
- Terminal Form :
- Ball
- Mounting Type :
- Surface Mount
- Terminal Pitch :
- 1mm
- Number of CLBs :
- 384
- Number of Logic Elements/Cells :
- 1728
- Lead Free :
- Contains Lead
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Height Seated (Max) :
- 2mm
- Mount :
- Surface Mount
- Operating Temperature :
- 0°C~85°C TJ
- Speed Grade :
- 6
- Terminal Position :
- BOTTOM
- Operating Supply Voltage :
- 1.8V
- Number of I/O :
- 176
- Number of LABs/CLBs :
- 384
- Pin Count :
- 256
- Clock Frequency :
- 357MHz
- HTS Code :
- 8542.39.00.01
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Peak Reflow Temperature (Cel) :
- 225
- Width :
- 17mm
- Voltage - Supply :
- 1.71V~1.89V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- XCV50E-6FG256C
FPGAs AMD Xilinx XCV50E-6FG256C Overview
The AMD Xilinx XCV50E-6FG256C FPGA stands as a cornerstone in modern digital circuit design, offering a highly flexible and scalable architecture tailored for a variety of demanding applications. This IC FPGA integrates 176 I/O on a 256FBGA package, making it an excellent choice for designers looking for robust performance in compact form factors. With its ability to be programmed and re-programmed to adapt to different tasks and changing requirements, the FPGAs AMD Xilinx XCV50E-6FG256C ensures longevity and relevance in rapidly evolving technological landscapes, making it ideal for bulk purchases by B2B customers who require dynamic, future-proof solutions.
XCV50E-6FG256C Features
This FPGA features a 256-pin fine-pitch ball grid array (FBGA) package that provides a secure and efficient connection while minimizing the PCB space required. The device supports a wide range of digital and mixed-signal applications thanks to its 176 I/O pins, offering ample flexibility for interfacing with other hardware components. Additionally, its configuration is optimized for a 6ns delay, enabling high-speed operation critical for real-time processing tasks.
XCV50E-6FG256C Applications
- Telecommunications Equipment: Utilized in routers and switches, the XCV50E-6FG256C can manage multiple data streams simultaneously, enhancing the efficiency and speed of network infrastructure.
- Consumer Electronics: This FPGA is ideal for use in high-performance gaming consoles and home entertainment systems, where rapid processing and flexible I/O configuration are crucial.
- Automotive Systems: In automotive applications, the XCV50E-6FG256C supports advanced driver-assistance systems (ADAS) by processing input from multiple sensors in real time to ensure safety and performance.
- Industrial Automation: For industrial environments, this FPGA enables sophisticated control systems, including robotics and manufacturing process controllers, by providing adaptable, high-speed I/O interfaces necessary for real-time decision-making.
- Aerospace and Defense: The robust configuration and high I/O count make the XCV50E-6FG256C suitable for applications in aerospace and defense, where reliability and adaptability are paramount.
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