XCV50-6FG256C
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- Mfr.Part #
- XCV50-6FG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 176 I/O 256FBGA
- Stock
- 1,535
- In Stock ：
- 1,535
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Logic Elements/Cells :
- 1728
- Reach Compliance Code :
- not_compliant
- Published :
- 2000
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Number of Inputs :
- 176
- ECCN Code :
- EAR99
- RoHS Status :
- Non-RoHS Compliant
- Width :
- 17mm
- Pin Count :
- 256
- Package / Case :
- 256-BGA
- Terminal Position :
- BOTTOM
- Combinatorial Delay of a CLB-Max :
- 0.6 ns
- JESD-609 Code :
- e0
- Operating Temperature :
- 0°C~85°C TJ
- Peak Reflow Temperature (Cel) :
- 225
- Base Part Number :
- XCV50
- Number of I/O :
- 176
- Time@Peak Reflow Temperature-Max (s) :
- 30
- HTS Code :
- 8542.39.00.01
- JESD-30 Code :
- S-PBGA-B256
- Number of Terminations :
- 256
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Gates :
- 57906
- RAM Size :
- 4kB
- Series :
- Virtex®
- Height Seated (Max) :
- 2mm
- Packaging :
- Tray
- Mount :
- Surface Mount
- Total RAM Bits :
- 32768
- Supply Voltage :
- 2.5V
- Power Supplies :
- 1.2/3.62.5V
- Clock Frequency :
- 333MHz
- Number of Outputs :
- 176
- Length :
- 17mm
- Voltage - Supply :
- 2.375V~2.625V
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Lead Free :
- Contains Lead
- Terminal Pitch :
- 1mm
- Number of CLBs :
- 384
- Number of LABs/CLBs :
- 384
- Mounting Type :
- Surface Mount
- Pbfree Code :
- No
- Datasheets
- XCV50-6FG256C
XCV50-6FG256C Documents
FPGAs AMD Xilinx XCV50-6FG256C Overview
The FPGAs AMD Xilinx XCV50-6FG256C is a highly versatile integrated circuit designed by AMD Xilinx for applications that require flexibility, high performance, and efficient power management in a compact form factor. This FPGA features a robust 256FBGA package, making it ideal for dense board configurations where space is at a premium. With its ability to reprogram on the fly, it provides designers with the freedom to innovate and adapt to evolving technical requirements without the need for extensive hardware modifications. The XCV50-6FG256C is particularly well-suited for developing complex digital logic circuits and facilitating rapid prototyping, offering a scalable solution that meets the demands of both high-volume production and precision-focused applications.
XCV50-6FG256C Features
The XCV50-6FG256C from AMD Xilinx incorporates 176 I/O pins, providing ample connectivity for various peripheral devices. Its 256FBGA packaging ensures a minimal footprint, while maintaining superior performance and reliability. This FPGA is designed to support a wide range of operating voltages, enhancing its utility in multi-voltage systems. It is built for durability and to withstand the rigors of extensive operational cycles, making it a reliable choice for critical and continuous applications.
XCV50-6FG256C Applications
- Telecommunications: Employed in routing and switching applications, the XCV50-6FG256C manages data flow efficiently across multiple network layers, enhancing bandwidth and reducing latency in complex telecom infrastructures.
- Automotive: Integrated into driver assistance systems, this FPGA processes multiple inputs from sensors and cameras to provide real-time data for safety features, including collision avoidance and lane departure warnings.
- Industrial Automation: In automation systems, the XCV50-6FG256C controls machinery and processes, optimizing operational parameters for improved productivity and precision in high-tech manufacturing setups.
- Consumer Electronics: Utilized in home entertainment systems, it enables high-speed signal processing for audio and video devices, ensuring enhanced user experiences with minimal power consumption.
- Aerospace and Defense: This FPGA meets stringent standards for reliability and performance, crucial in the development of navigation and communication systems in aerospace and defense sectors.
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