XCV50-6BG256C

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Mfr.Part #
XCV50-6BG256C
Manufacturer
AMD Xilinx
Package / Case
256-BBGA
Datasheet
Download
Description
IC FPGA 180 I/O 256BGA
Stock
25,994
In Stock :
25,994

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Position :
BOTTOM
Number of Terminations :
256
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Reach Compliance Code :
not_compliant
Package / Case :
256-BBGA
Number of LABs/CLBs :
384
Operating Temperature :
0°C~85°C TJ
Terminal Finish :
Tin/Lead (Sn63Pb37)
Mount :
Surface Mount
Width :
27mm
Length :
27mm
Supply Voltage :
2.5V
HTS Code :
8542.39.00.01
Number of I/O :
180
Number of CLBs :
384
Lead Free :
Contains Lead
Time@Peak Reflow Temperature-Max (s) :
30
Power Supplies :
1.2/3.62.5V
Height Seated (Max) :
2.55mm
Number of Pins :
256
Terminal Form :
Ball
RoHS Status :
Non-RoHS Compliant
Terminal Pitch :
1.27mm
Pin Count :
256
Peak Reflow Temperature (Cel) :
225
Voltage - Supply :
2.375V~2.625V
ECCN Code :
EAR99
Number of Logic Elements/Cells :
1728
Mounting Type :
Surface Mount
Qualification Status :
Not Qualified
JESD-609 Code :
e0
Pbfree Code :
No
Base Part Number :
XCV50
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Total RAM Bits :
32768
Published :
2000
Number of Outputs :
180
Clock Frequency :
333MHz
Packaging :
Tray
RAM Size :
4kB
Combinatorial Delay of a CLB-Max :
0.6 ns
Series :
Virtex®
Number of Gates :
57906
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCV50-6BG256C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:256, Package / Case:256-BBGA, Operating Temperature:0°C~85°C TJ, Number of Pins:256, Mounting Type:Surface Mount, Base Part Number:XCV50, XCV50-6BG256C pinout, XCV50-6BG256C datasheet PDF, XCV50-6BG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCV50-6BG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCV50-6BG256C


FPGAs AMD Xilinx XCV50-6BG256C Overview

The FPGAs AMD Xilinx XCV50-6BG256C is a highly capable integrated circuit from AMD Xilinx, designed for versatility and high performance in a variety of complex digital computing environments. This FPGA (Field Programmable Gate Array) is crafted to support rapid prototyping and flexible design adaptations, making it an indispensable tool for engineers and developers aiming to push the boundaries of technological innovation. Its compact 256-ball grid array (BGA) packaging ensures a minimal footprint on system boards, thus optimizing the overall design space and enhancing system reliability.

XCV50-6BG256C Features

This FPGA features 180 user I/O pins, allowing for extensive connectivity and interfacing with a wide range of peripheral devices. The device is tailored to meet the demanding requirements of high-speed digital processing, providing a robust platform for developing sophisticated multi-functional devices. Its configuration is optimized for a cost-effective integration into system-on-chip (SoC) solutions, making it a preferred choice for developers looking to maximize functionality while minimizing costs.

XCV50-6BG256C Applications

  • Telecommunications: Utilized in communication infrastructure to facilitate complex signal processing tasks, improving bandwidth and data transmission capabilities.
  • Automotive Electronics: Integrated into automotive systems for handling advanced driver-assistance systems (ADAS), ensuring higher safety and better vehicle control.
  • Consumer Electronics: Employed in devices such as high-performance gaming consoles and smart home systems, enhancing processing power and user experience.
  • Industrial Automation: Used in control systems for manufacturing lines, improving automation efficiency and reliability through sophisticated control algorithms.
  • Medical Devices: Essential in the development of medical imaging systems, enabling complex data analysis and real-time processing for better diagnostic tools.
This HTML content provides a structured and detailed overview of the FPGA device, highlighting its capabilities and applications tailored for B2B clients interested in its diverse usage across several high-demand industries.
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