XCKU9P-3FFVE900E
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- Mfr.Part #
- XCKU9P-3FFVE900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 304 I/O 900FCBGA
- Stock
- 36,060
- In Stock ：
- 36,060
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of LABs/CLBs :
- 34260
- Packaging :
- Tray
- Package / Case :
- 900-BBGA, FCBGA
- RoHS Status :
- ROHS3 Compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Series :
- Kintex® UltraScale+™
- Operating Temperature :
- 0°C~100°C TJ
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Factory Lead Time :
- 11 Weeks
- Number of I/O :
- 304
- Total RAM Bits :
- 41881600
- HTS Code :
- 8542.39.00.01
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 599550
- Voltage - Supply :
- 0.873V~0.927V
- Datasheets
- XCKU9P-3FFVE900E
FPGAs Kintex® UltraScale+™ Series 900-BBGA, FCBGA
XCKU9P-3FFVE900E Overview
In the package 900-BBGA, FCBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 304 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 599550 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 0.873V~0.927V, this device operates with ease. This is a type of FPGA that is part of the Kintex® UltraScale+™ series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 41881600 bfpga electronics s of RAM. The FPGA is built as an array of 34260 latches or CLBs.
XCKU9P-3FFVE900E Features
304 I/Os
Up to 41881600 RAM bits
XCKU9P-3FFVE900E Applications
There are a lot of Xilinx Inc.
XCKU9P-3FFVE900E FPGAs applications.
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
- Distributed Monetary Systems
- Data Center
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