XCKU025-2FFVA1156E

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Mfr.Part #
XCKU025-2FFVA1156E
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 312 I/O 1156FCBGA
Stock
45,358
In Stock :
45,358

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
ROHS3 Compliant
JESD-30 Code :
S-PBGA-B1156
Number of Outputs :
312
Number of Inputs :
312
Terminal Pitch :
1mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Packaging :
Bulk
Series :
Kintex® UltraScale™
Factory Lead Time :
10 Weeks
Packing Method :
Tray
Terminal Position :
BOTTOM
Mount :
Surface Mount
Package / Case :
1156-BBGA, FCBGA
Width :
35mm
Length :
35mm
Speed Grade :
2
Published :
2012
Operating Supply Voltage :
950mV
Lead Free :
Lead Free
Terminal Form :
Ball
Mounting Type :
Surface Mount
Total RAM Bits :
13004800
RAM Size :
1.6MB
Supply Voltage :
0.95V
Number of LABs/CLBs :
18180
Number of I/O :
312
Height Seated (Max) :
3.51mm
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Operating Temperature :
0°C~100°C TJ
Number of Registers :
290880
Number of Logic Elements/Cells :
318150
Voltage - Supply :
0.922V~0.979V
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU025-2FFVA1156E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1156-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, XCKU025-2FFVA1156E pinout, XCKU025-2FFVA1156E datasheet PDF, XCKU025-2FFVA1156E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU025-2FFVA1156E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU025-2FFVA1156E


FPGAs AMD Xilinx XCKU025-2FFVA1156E Overview

The FPGAs AMD Xilinx XCKU025-2FFVA1156E is a cutting-edge integrated circuit designed for versatile applications requiring high-speed digital processing and flexibility. This IC FPGA from AMD Xilinx stands out due to its robust configuration of 312 I/O pins, housed in a 1156FCBGA package, making it exceptionally suitable for sophisticated digital environments where space and efficiency are critical. The use of advanced technology in the XCKU025-2FFVA1156E ensures that it can meet the rigorous demands of modern digital applications, making it an ideal choice for designers looking for a high-performance FPGA solution.

XCKU025-2FFVA1156E Features

This FPGA is equipped with 312 I/O pins that enable extensive connectivity and compatibility with a wide range of digital components and peripheral devices. Its 1156-pin FCBGA (Flip-Chip Ball Grid Array) package ensures a reliable and robust connection to the PCB, critical for high-density integration which is often required in advanced computing systems. Additionally, the high configurability of the XCKU025-2FFVA1156E allows for tailored application-specific designs, thereby optimizing both performance and power efficiency.

XCKU025-2FFVA1156E Applications

  • Data Centers: Utilized in server farms for accelerating data processing tasks, reducing latency and enhancing throughput capabilities.
  • Telecommunications: Employed in communication infrastructure to manage signal processing operations effectively, ensuring faster and more reliable data transmission.
  • Aerospace and Defense: Integrated into avionics for real-time signal processing, enhancing navigation systems and surveillance equipment reliability and performance.
  • Medical Imaging: Applied in advanced medical imaging systems, such as MRI and CT scanners, to speed up image processing and improve diagnostic accuracy.
  • Automotive: Used in automotive electronics for controlling and managing advanced driver-assistance systems (ADAS), improving vehicle safety and performance.
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