XCKU035-2FBVA676E
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- Mfr.Part #
- XCKU035-2FBVA676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 312 I/O 676FCBGA
- Stock
- 31,489
- In Stock ：
- 31,489
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- JESD-609 Code :
- e1
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Factory Lead Time :
- 10 Weeks
- Published :
- 2012
- Number of Logic Elements/Cells :
- 444343
- Speed Grade :
- 2
- Mounting Type :
- Surface Mount
- Number of I/O :
- 312
- Number of Terminations :
- 676
- Number of LABs/CLBs :
- 25391
- Number of Pins :
- 676
- Organization :
- 1700 CLBS
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 0.95V
- Number of CLBs :
- 1700
- Series :
- Kintex® UltraScale™
- Operating Temperature :
- 0°C~100°C TJ
- Contact Plating :
- Copper, Silver, Tin
- RAM Size :
- 2.4MB
- Terminal Pitch :
- 1mm
- Packaging :
- Bulk
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Outputs :
- 312
- Number of Registers :
- 406256
- Terminal Form :
- Ball
- Qualification Status :
- Not Qualified
- Package / Case :
- 676-BBGA, FCBGA
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Mount :
- Surface Mount
- Packing Method :
- Tray
- Voltage - Supply :
- 0.922V~0.979V
- RoHS Status :
- ROHS3 Compliant
- Power Supplies :
- 0.95V
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- ECCN Code :
- 3A991.D
- Operating Supply Voltage :
- 950mV
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Total RAM Bits :
- 19456000
- Datasheets
- XCKU035-2FBVA676E
FPGAs AMD Xilinx XCKU035-2FBVA676E Overview
The FPGAs AMD Xilinx XCKU035-2FBVA676E represents a cutting-edge FPGA (Field Programmable Gate Array) technology, engineered by AMD Xilinx to meet the increasing demands of modern digital circuits. This product is designed for optimal configurability, boasting a dense arrangement of logic blocks and versatile I/O options enclosed in a 676-pin flip-chip BGA (FCBGA) package. The XCKU035-2FBVA676E caters primarily to designers who require a balance between high-performance data processing and low power consumption, making it ideal for a wide range of applications in the industrial, communications, and automotive sectors.
XCKU035-2FBVA676E Features
The XCKU035-2FBVA676E offers a comprehensive suite of features designed to support complex digital systems:
- 312 I/O pins: Extensive interfacing capabilities with a high number of Input/Output pins to support diverse external connections.
- 676-FCBGA package: Compact and efficient packaging that helps reduce the overall footprint on system boards and enhances thermal performance.
- High configurability: Adaptable logic blocks allow for high degrees of customization to suit specific application needs.
- Power efficiency: Advanced design optimized for low power consumption, preserving battery life and reducing operational costs in energy-sensitive projects.
XCKU035-2FBVA676E Applications
- Telecommunications: Utilized in base stations and networking equipment, the XCKU035-2FBVA676E facilitates rapid data transmission and processing capabilities essential for modern telecom infrastructures.
- Automotive: Employs robust processing power to handle advanced driver-assistance systems (ADAS), ensuring real-time performance and reliability in critical safety operations.
- Industrial Automation: Enhances the efficiency and precision of robotics and control systems in manufacturing lines, capable of managing complex operations through customizable logic configurations.
- Data Centers: Critical in managing data flow and processing tasks within servers and storage units, the FPGA supports high-speed data operations and scalability for growing infrastructure needs.
- Consumer Electronics: Applied in high-definition video processing units and gaming consoles, providing the necessary speed and flexibility for enhanced user experiences.
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