XCKU035-2FBVA900E
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- Mfr.Part #
- XCKU035-2FBVA900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 468 I/O 900FCBGA
- Stock
- 46,333
- In Stock ：
- 46,333
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- JESD-609 Code :
- e1
- Packaging :
- Bulk
- Number of I/O :
- 468
- JESD-30 Code :
- S-PBGA-B900
- Organization :
- 1700 CLBS
- Voltage - Supply :
- 0.922V~0.979V
- Total RAM Bits :
- 19456000
- Surface Mount :
- yes
- Packing Method :
- Tray
- Mounting Type :
- Surface Mount
- RAM Size :
- 2.4MB
- Operating Temperature :
- 0°C~100°C TJ
- ECCN Code :
- 3A991.D
- Terminal Position :
- BOTTOM
- Factory Lead Time :
- 10 Weeks
- Terminal Pitch :
- 1mm
- Length :
- 31mm
- Package / Case :
- 900-BBGA, FCBGA
- Height Seated (Max) :
- 2.8mm
- Power Supplies :
- 0.95V
- Terminal Form :
- Ball
- Number of Logic Elements/Cells :
- 444343
- Number of Inputs :
- 468
- RoHS Status :
- ROHS3 Compliant
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of CLBs :
- 1700
- Number of Outputs :
- 468
- Supply Voltage :
- 0.95V
- Width :
- 31mm
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations :
- 900
- Series :
- Kintex® UltraScale™
- Published :
- 2012
- HTS Code :
- 8542.39.00.01
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of LABs/CLBs :
- 25391
- Datasheets
- XCKU035-2FBVA900E
FPGAs AMD Xilinx XCKU035-2FBVA900E Overview
The FPGAs AMD Xilinx XCKU035-2FBVA900E represents a highly advanced field programmable gate array designed for versatility and high-performance within multiple sectors. Manufactured by AMD Xilinx, a leader in digital design and fabrication, this FPGA features a robust configuration that allows for rapid deployment and scalability. The XCKU035-2FBVA900E is housed in a 900FCBGA package, facilitating efficient thermal management and compact integration. It boasts a substantial array of 468 I/Os, making it particularly suitable for complex digital processing tasks where multiple inputs and outputs are necessary. This component is ideal for businesses looking to integrate adaptable logic devices that require high throughput and minimal latency.
XCKU035-2FBVA900E Features
The XCKU035-2FBVA900E FPGA from AMD Xilinx includes numerous features that set it apart in the field of programmable logic. Key features include its 900-ball flip-chip BGA packaging that ensures robust physical integrity and enhanced thermal characteristics, facilitating better performance under varying operational conditions. The device’s high I/O count supports extensive interfacing capabilities, essential for comprehensive digital communication and processing tasks. Furthermore, this FPGA is compatible with advanced design software, providing developers with the tools needed to create sophisticated, custom configurations tailored to their specific requirements.
XCKU035-2FBVA900E Applications
- Data Centers: Utilized in server farms for accelerating data processing and handling complex algorithms efficiently. The FPGA's high I/O count and speed facilitate faster data throughput and improved response times in data-intensive environments.
- Telecommunications: Integral in the development of telecommunications infrastructure, such as in signal processing and network data flow management. Its adaptability allows for rapid reconfiguration to support varying bandwidth and communication standards.
- Aerospace and Defense: Employed in systems requiring high reliability and the ability to operate under harsh conditions. The FPGA can handle multiple input and output operations critical for navigation, control systems, and real-time data processing.
- Medical Devices: Applied in medical imaging systems such as MRI and CT scanners, where rapid data processing and precise control are crucial. The XCKU035-2FBVA900E's capabilities ensure that high-resolution images are processed efficiently, leading to quicker and more accurate diagnoses.
- Automotive: Used in advanced driver-assistance systems (ADAS) to process real-time inputs from vehicle sensors and to provide quick decision-making capabilities. The FPGA’s flexibility also supports updates and reconfigurations as automotive technology evolves.
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