XCKU9P-2FFVE900I

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Mfr.Part #
XCKU9P-2FFVE900I
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 304 I/O 900FCBGA
Stock
48,623
In Stock :
48,623

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
-40°C~100°C TJ
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of I/O :
304
Factory Lead Time :
11 Weeks
Packaging :
Bulk
Voltage - Supply :
0.825V~0.876V
Number of Logic Elements/Cells :
599550
RoHS Status :
ROHS3 Compliant
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Series :
Kintex® UltraScale+™
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Mounting Type :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of LABs/CLBs :
34260
HTS Code :
8542.39.00.01
Package / Case :
900-BBGA, FCBGA
Total RAM Bits :
41881600
Datasheets
XCKU9P-2FFVE900I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU9P-2FFVE900I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, Package / Case:900-BBGA, FCBGA, XCKU9P-2FFVE900I pinout, XCKU9P-2FFVE900I datasheet PDF, XCKU9P-2FFVE900I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU9P-2FFVE900I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Kintex® UltraScale+™ Series 900-BBGA, FCBGA

XCKU9P-2FFVE900I Overview


Fpga chips is supplied in the 900-BBGA, FCBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 304 I/Os for transferring data in a more coherent manner. There are 599550 logic elements/cells to form a fundamental building block. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. It is a type of FPGA belonging to the Kintex® UltraScale+™ seies. The operating temperature should be kept at -40°C~100°C TJ when operating. This FPGA model is contained in Bulk for space saving. The RAM bits that this device offer is 41881600. This FPGA is built as an array of 34260 LABs/CLBs.

XCKU9P-2FFVE900I Features


304 I/Os
Up to 41881600 RAM bits


XCKU9P-2FFVE900I Applications


There are a lot of Xilinx Inc.
XCKU9P-2FFVE900I FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
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