XCKU5P-3FFVB676E
- Mfr.Part #
- XCKU5P-3FFVB676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 280 I/O 676FCBGA
- Stock
- 38,324
- In Stock :
- 38,324
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Total RAM Bits :
- 41984000
- Series :
- Kintex® UltraScale+™
- RoHS Status :
- ROHS3 Compliant
- Operating Temperature :
- 0°C~100°C TJ
- Packaging :
- Tray
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Voltage - Supply :
- 0.825V~0.876V
- HTS Code :
- 8542.39.00.01
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Package / Case :
- 676-BBGA, FCBGA
- Number of I/O :
- 280
- Factory Lead Time :
- 11 Weeks
- Number of Logic Elements/Cells :
- 474600
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Mounting Type :
- Surface Mount
- Number of LABs/CLBs :
- 27120
- Datasheets
- XCKU5P-3FFVB676E

FPGAs AMD Xilinx XCKU5P-3FFVB676E Overview
The AMD Xilinx XCKU5P-3FFVB676E represents a cutting-edge solution within the field of Field Programmable Gate Arrays (FPGAs), designed to cater to complex digital circuits with a need for flexible and rapid prototyping capabilities. This model is housed in a 676-pin FCBGA (Flip-Chip Ball Grid Array) package, providing robust support for a wide array of I/O options with up to 280 available. It offers exceptional performance for applications requiring high-speed signal processing and real-time data manipulation. Ideal for developers looking to push the boundaries of hardware acceleration, the XCKU5P-3FFVB676E is engineered to optimize power and performance efficiency across diverse operational environments.
XCKU5P-3FFVB676E Features
This FPGA unit is designed for versatility and high performance, integrating numerous features that support advanced digital computing needs:
- High I/O Pin Count: Features 280 I/O pins, allowing extensive connectivity for various components and peripheral devices.
- Compact 676-FCBGA Package: Ensures a minimal footprint on system boards, ideal for dense circuit designs.
- Advanced Configuration Options: Supports numerous configuration settings, enabling highly customized implementations tailored to specific needs.
- Energy Efficient: Optimized power management for reduced operational costs and enhanced sustainability.
XCKU5P-3FFVB676E Applications
- Telecommunications: Used in the infrastructure of 5G networks, enhancing data throughput and reliability through advanced signal processing capabilities.
- Automotive Systems: Employs in driver assistance systems (ADAS), providing the necessary computing power to process real-time sensor data for safer driving experiences.
- Data Centers: Facilitates accelerated computing tasks, improving efficiency in data processing operations crucial for server farms and cloud services.
- Consumer Electronics: Integrated into smart home devices, enabling complex logic operations that support increased device intelligence and connectivity.
- Industrial Automation: Applied in control systems to handle precise and variable processing tasks, improving operational efficiency and productivity in manufacturing processes.
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