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  6. XCKU5P-2FFVD900E
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    XCKU5P-2FFVD900E

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    Mfr.Part #
    XCKU5P-2FFVD900E
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC FPGA 304 I/O 900FCBGA
    Stock
    39,467
    In Stock ：
    39,467

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    Manufacturer :
    AMD Xilinx
    Product Category :
    FPGAs (Field Programmable Gate Array)
    Programmable Logic Type :
    FIELD PROGRAMMABLE GATE ARRAY
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    HTS Code :
    8542.39.00.01
    Number of Logic Elements/Cells :
    474600
    Voltage - Supply :
    0.825V~0.876V
    Packaging :
    Tray
    Series :
    Kintex® UltraScale+™
    RoHS Status :
    ROHS3 Compliant
    Mounting Type :
    Surface Mount
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Terminal Finish :
    Tin/Silver/Copper (Sn/Ag/Cu)
    JESD-609 Code :
    e1
    Factory Lead Time :
    11 Weeks
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Package / Case :
    900-BBGA, FCBGA
    Number of LABs/CLBs :
    27120
    Total RAM Bits :
    41984000
    Number of I/O :
    304
    Pbfree Code :
    yes
    Operating Temperature :
    0°C~100°C TJ
    Datasheets
    XCKU5P-2FFVD900E
    Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU5P-2FFVD900E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type：Surface Mount, Package / Case：900-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, XCKU5P-2FFVD900E pinout, XCKU5P-2FFVD900E datasheet PDF, XCKU5P-2FFVD900E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU5P-2FFVD900E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCKU5P-2FFVD900E


    FPGAs AMD Xilinx XCKU5P-2FFVD900E Overview

    Introducing the AMD Xilinx XCKU5P-2FFVD900E, a highly capable FPGA from one of the industry's leading technology innovators. This product is designed to meet the demanding requirements of modern digital circuits, offering a flexible and powerful solution for a wide range of applications. The XCKU5P-2FFVD900E comes in a 900FCBGA package, providing robust connectivity with 304 I/O options, enabling extensive interfacing and performance capabilities. Its integration in advanced systems highlights the product’s adaptability and efficiency, making it an excellent choice for businesses looking to leverage high-performance computing and real-time processing capabilities.

    XCKU5P-2FFVD900E Features

    The XCKU5P-2FFVD900E FPGA is packed with features that make it a prime choice for developers and engineers. Key attributes include its extensive I/O interface, supporting up to 304 pins, which allows for flexible and scalable designs. The 900-ball fine-pitch BGA package ensures a compact form factor while enabling efficient thermal management and high-density integration. This FPGA is optimized for low power consumption and high-speed data processing, suitable for a wide array of complex digital computations and signal processing tasks.

    XCKU5P-2FFVD900E Applications

    • Telecommunications: Utilized in communication infrastructure to manage signal processing tasks efficiently, ensuring faster data transmission and improved signal integrity.
    • Data Centers: Plays a critical role in managing data workflows, accelerating data processing, and supporting cloud storage solutions through high-speed, reliable data handling capabilities.
    • Automotive: Incorporated into automotive safety and control systems, providing robust processing capabilities that enhance vehicle responsiveness and safety features.
    • Industrial Automation: Essential in automated manufacturing processes, where precision and reliability are required for control systems and robotic applications.
    • Consumer Electronics: Applied in high-performance consumer electronics to enhance multimedia processing, including advanced video rendering and real-time gaming experiences.
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    Shipping Cost

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