XCKU5P-2FFVB676I

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Mfr.Part #
XCKU5P-2FFVB676I
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 280 I/O 676FCBGA
Stock
42,635
In Stock :
42,635

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2012
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
RoHS Status :
ROHS3 Compliant
Number of Logic Elements/Cells :
474600
Factory Lead Time :
11 Weeks
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Mounting Type :
Surface Mount
Package / Case :
676-BBGA, FCBGA
Series :
Kintex® UltraScale+™
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Packaging :
Tray
RAM Size :
2.1MB
Total RAM Bits :
41984000
HTS Code :
8542.39.00.01
Number of I/O :
280
Number of LABs/CLBs :
27120
Voltage - Supply :
0.825V~0.876V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
-40°C~100°C TJ
Datasheets
XCKU5P-2FFVB676I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU5P-2FFVB676I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:676-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, XCKU5P-2FFVB676I pinout, XCKU5P-2FFVB676I datasheet PDF, XCKU5P-2FFVB676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU5P-2FFVB676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU5P-2FFVB676I


FPGAs AMD Xilinx XCKU5P-2FFVB676I Overview

Introducing the FPGAs AMD Xilinx XCKU5P-2FFVB676I, a cutting-edge field programmable gate array (FPGA) that embodies high performance and adaptability in a compact 676-pin flip-chip ball grid array (FCBGA) package. This FPGA is tailored to meet the demanding requirements of modern embedded systems, offering a robust blend of connectivity, processing power, and energy efficiency. With its substantial I/O capabilities and advanced feature set, the XCKU5P-2FFVB676I is ideal for developers looking to push the boundaries of technology in high-speed computing and digital signal processing applications.

XCKU5P-2FFVB676I Features

The XCKU5P-2FFVB676I FPGA is designed with 280 I/Os, providing ample connectivity options for various system components and peripherals. Its integration in a 676FCBGA package ensures a reliable and durable connection, crucial for high-density and high-performance applications. This FPGA is not only powerful but also offers flexibility in design adjustments, catering to both prototyping and mass production needs.

XCKU5P-2FFVB676I Applications

  • Data Centers: Utilized for accelerating workloads, the XCKU5P-2FFVB676I efficiently manages multiple operations, enhancing data throughput and system reliability.
  • Telecommunications: This FPGA supports the development of telecommunications infrastructure by facilitating faster signal processing and increased bandwidth capabilities.
  • Aerospace and Defense: In critical applications such as satellite communications, the XCKU5P-2FFVB676I provides the necessary robustness and high-level data processing capabilities.
  • Automotive: Enhancing automotive safety systems, this FPGA processes complex algorithms quickly, improving response times in advanced driver-assistance systems (ADAS).
  • Medical Imaging: With its high processing power, the XCKU5P-2FFVB676I aids in the fast processing of complex imaging algorithms, crucial for medical diagnostics and research.
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