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  6. XCKU5P-2FFVA676E
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    Mfr.Part #
    XCKU5P-2FFVA676E
    Manufacturer
    AMD Xilinx
    Package / Case
    676-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC FPGA 256 I/O 676FCBGA
    Stock
    44,981
    In Stock ：
    44,981

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    Manufacturer :
    AMD Xilinx
    Product Category :
    FPGAs (Field Programmable Gate Array)
    Number of I/O :
    256
    Package / Case :
    676-BBGA, FCBGA
    Operating Temperature :
    0°C~100°C TJ
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Packaging :
    Tray
    RoHS Status :
    ROHS3 Compliant
    Terminal Finish :
    Tin/Silver/Copper (Sn/Ag/Cu)
    Voltage - Supply :
    0.825V~0.876V
    Factory Lead Time :
    11 Weeks
    Number of LABs/CLBs :
    27120
    Published :
    2012
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Pbfree Code :
    yes
    Mounting Type :
    Surface Mount
    Series :
    Kintex® UltraScale+™
    Programmable Logic Type :
    FIELD PROGRAMMABLE GATE ARRAY
    Total RAM Bits :
    41984000
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Number of Logic Elements/Cells :
    474600
    HTS Code :
    8542.39.00.01
    JESD-609 Code :
    e1
    Datasheets
    XCKU5P-2FFVA676E
    Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU5P-2FFVA676E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：676-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, Mounting Type：Surface Mount, XCKU5P-2FFVA676E pinout, XCKU5P-2FFVA676E datasheet PDF, XCKU5P-2FFVA676E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU5P-2FFVA676E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCKU5P-2FFVA676E


    FPGAs AMD Xilinx XCKU5P-2FFVA676E Overview

    The FPGAs AMD Xilinx XCKU5P-2FFVA676E is a high-performance, field-programmable gate array that is ideal for a wide range of demanding applications. Manufactured by AMD Xilinx, this IC FPGA features a robust 676-pin flip-chip ball grid array (FCBGA) package that ensures excellent connectivity and durability. Designed to support a broad spectrum of functionalities, the XCKU5P-2FFVA676E facilitates complex digital computations and is capable of handling multiple inputs and outputs with 256 I/O interfaces, making it an essential component for advanced digital systems.

    XCKU5P-2FFVA676E Features

    This FPGA from AMD Xilinx is tailored for versatile deployments in high-tech environments, where superior speed and adaptability are required. Key features include:

    • Robust 676-FCBGA packaging for reliable physical integration.
    • Extensive interfacing options with 256 I/O pins, accommodating a variety of digital and analog signals.
    • Scalable architecture, suitable for both small-scale experiments and large, complex systems.

    XCKU5P-2FFVA676E Applications

    • Telecommunications Infrastructure: Utilized in routers and switches to manage data traffic efficiently and increase bandwidth capacity.
    • Automotive Driver Assistance Systems: Enhances functionalities in driver assistance systems like adaptive cruise control and collision avoidance systems.
    • Medical Imaging Equipment: Critical in the processing and analysis of complex imaging data in devices such as MRI and CT scanners.
    • Industrial Automation: Drives the development of smarter, more efficient industrial control systems that require high-speed data processing.
    • Aerospace and Defense: Used in avionics for real-time systems monitoring and in control systems for unmanned aerial vehicles (UAVs).
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    Shipping Cost

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