XCKU3P-3SFVB784E
- Mfr.Part #
- XCKU3P-3SFVB784E
- Manufacturer
- AMD Xilinx
- Package / Case
- 784-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 304 I/O 784FCBGA
- Stock
- 24,774
- In Stock :
- 24,774
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage - Supply :
- 0.873V~0.927V
- Series :
- Kintex® UltraScale+™
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Factory Lead Time :
- 11 Weeks
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Packaging :
- Tray
- Operating Temperature :
- 0°C~100°C TJ
- Total RAM Bits :
- 31641600
- Number of Logic Elements/Cells :
- 355950
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Published :
- 2012
- HTS Code :
- 8542.39.00.01
- Package / Case :
- 784-BBGA, FCBGA
- Number of I/O :
- 304
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 20340
- Datasheets
- XCKU3P-3SFVB784E

FPGAs AMD Xilinx XCKU3P-3SFVB784E Overview
The FPGAs AMD Xilinx XCKU3P-3SFVB784E is a high-performance, feature-rich Field Programmable Gate Array (FPGA) designed to meet the demanding requirements of modern digital circuits. Manufactured by industry leader AMD Xilinx, this FPGA is housed in a 784-pin Flip-Chip Ball Grid Array (FCBGA) package and supports a wide array of I/O options with 304 I/O pins, making it highly versatile for various applications. The device is optimized for low power consumption and high-speed performance, making it an ideal choice for designers looking to leverage advanced system-level integration in a compact footprint.
XCKU3P-3SFVB784E Features
This FPGA model offers robust features that enhance its functionality and usability in complex digital environments. Key features include its extensive I/O capabilities which are critical for interfacing with other components in high-speed data environments. The compact 784FCBGA package ensures that it can be incorporated in space-constrained applications while still providing the flexibility and performance expected from a leading-edge AMD Xilinx product.
XCKU3P-3SFVB784E Applications
- Data Centers: Utilized for data processing and storage solutions, the XCKU3P-3SFVB784E enhances data throughput and reliability in server farms and storage arrays through its extensive I/O capabilities and high-speed performance.
- Telecommunications: In telecommunication equipment, this FPGA can manage complex signal processing tasks, contributing to improved bandwidth and enhanced network reliability for both wired and wireless communication systems.
- Automotive Technology: The device is used in automotive applications for driver assistance systems and in-vehicle infotainment (IVI) systems, providing the necessary processing power and connectivity options required in modern vehicles.
- Industrial Automation: Ideal for control systems in manufacturing and production lines, the FPGA can handle multiple control functions simultaneously, improving operational efficiency and reducing system latency.
- Consumer Electronics: Employed in consumer electronics such as high-definition televisions and gaming consoles, the XCKU3P-3SFVB784E supports sophisticated graphical processes and enhances user interaction responsiveness.
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