XCKU3P-3SFVB784E

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Mfr.Part #
XCKU3P-3SFVB784E
Manufacturer
AMD Xilinx
Package / Case
784-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 304 I/O 784FCBGA
Stock
24,774
In Stock :
24,774

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
0.873V~0.927V
Series :
Kintex® UltraScale+™
Mounting Type :
Surface Mount
RoHS Status :
ROHS3 Compliant
Factory Lead Time :
11 Weeks
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Packaging :
Tray
Operating Temperature :
0°C~100°C TJ
Total RAM Bits :
31641600
Number of Logic Elements/Cells :
355950
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Published :
2012
HTS Code :
8542.39.00.01
Package / Case :
784-BBGA, FCBGA
Number of I/O :
304
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of LABs/CLBs :
20340
Datasheets
XCKU3P-3SFVB784E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-3SFVB784E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, Package / Case:784-BBGA, FCBGA, XCKU3P-3SFVB784E pinout, XCKU3P-3SFVB784E datasheet PDF, XCKU3P-3SFVB784E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-3SFVB784E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU3P-3SFVB784E


FPGAs AMD Xilinx XCKU3P-3SFVB784E Overview

The FPGAs AMD Xilinx XCKU3P-3SFVB784E is a high-performance, feature-rich Field Programmable Gate Array (FPGA) designed to meet the demanding requirements of modern digital circuits. Manufactured by industry leader AMD Xilinx, this FPGA is housed in a 784-pin Flip-Chip Ball Grid Array (FCBGA) package and supports a wide array of I/O options with 304 I/O pins, making it highly versatile for various applications. The device is optimized for low power consumption and high-speed performance, making it an ideal choice for designers looking to leverage advanced system-level integration in a compact footprint.

XCKU3P-3SFVB784E Features

This FPGA model offers robust features that enhance its functionality and usability in complex digital environments. Key features include its extensive I/O capabilities which are critical for interfacing with other components in high-speed data environments. The compact 784FCBGA package ensures that it can be incorporated in space-constrained applications while still providing the flexibility and performance expected from a leading-edge AMD Xilinx product.

XCKU3P-3SFVB784E Applications

  • Data Centers: Utilized for data processing and storage solutions, the XCKU3P-3SFVB784E enhances data throughput and reliability in server farms and storage arrays through its extensive I/O capabilities and high-speed performance.
  • Telecommunications: In telecommunication equipment, this FPGA can manage complex signal processing tasks, contributing to improved bandwidth and enhanced network reliability for both wired and wireless communication systems.
  • Automotive Technology: The device is used in automotive applications for driver assistance systems and in-vehicle infotainment (IVI) systems, providing the necessary processing power and connectivity options required in modern vehicles.
  • Industrial Automation: Ideal for control systems in manufacturing and production lines, the FPGA can handle multiple control functions simultaneously, improving operational efficiency and reducing system latency.
  • Consumer Electronics: Employed in consumer electronics such as high-definition televisions and gaming consoles, the XCKU3P-3SFVB784E supports sophisticated graphical processes and enhances user interaction responsiveness.
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