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  6. XCKU3P-3FFVA676E
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    Mfr.Part #
    XCKU3P-3FFVA676E
    Manufacturer
    AMD Xilinx
    Package / Case
    676-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC FPGA 256 I/O 676FCBGA
    Stock
    9,334
    In Stock ：
    9,334

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    Manufacturer :
    AMD Xilinx
    Product Category :
    FPGAs (Field Programmable Gate Array)
    Series :
    Kintex® UltraScale+™
    HTS Code :
    8542.39.00.01
    Factory Lead Time :
    11 Weeks
    Operating Temperature :
    0°C~100°C TJ
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Published :
    2012
    Number of I/O :
    256
    RoHS Status :
    ROHS3 Compliant
    Total RAM Bits :
    31641600
    Number of LABs/CLBs :
    20340
    Package / Case :
    676-BBGA, FCBGA
    Number of Logic Elements/Cells :
    355950
    Packaging :
    Tray
    Programmable Logic Type :
    FIELD PROGRAMMABLE GATE ARRAY
    Voltage - Supply :
    0.873V~0.927V
    Mounting Type :
    Surface Mount
    Datasheets
    XCKU3P-3FFVA676E
    Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-3FFVA676E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：676-BBGA, FCBGA, Mounting Type：Surface Mount, XCKU3P-3FFVA676E pinout, XCKU3P-3FFVA676E datasheet PDF, XCKU3P-3FFVA676E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-3FFVA676E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCKU3P-3FFVA676E


    FPGAs AMD Xilinx XCKU3P-3FFVA676E Overview

    The FPGAs AMD Xilinx XCKU3P-3FFVA676E represents a pinnacle of technological advancement in the field of programmable logic devices. This integrated circuit, housed in a 676-pin FCBGA package, offers a versatile solution adaptable to a myriad of complex digital systems. Engineered by AMD Xilinx, this FPGA excels in delivering high performance with its robust I/O capabilities and efficient power management, making it ideal for applications demanding high-speed data processing and precise control. The product's adaptability and scalability make it a prime choice for developers looking to push the boundaries of digital innovation.

    XCKU3P-3FFVA676E Features

    This particular model boasts an array of features designed to meet the most rigorous technological demands. With 256 I/O pins, it facilitates extensive interfacing options, allowing for a wide range of peripherals and devices to be connected. The 676FCBGA package ensures a compact footprint while providing superior performance in terms of heat dissipation and signal integrity. The FPGA's architecture supports a variety of logic configuration options, empowering engineers to customize the functionality according to specific project needs.

    XCKU3P-3FFVA676E Applications

    • Data Centers: Utilized for managing extensive data flows, ensuring efficient processing and routing of information within modern data centers.
    • Telecommunications: Plays a critical role in signal processing tasks necessary for modern telecom infrastructures, such as base stations and network switches.
    • Automotive: Applied in driver assistance systems, where fast and reliable processing is crucial for real-time decision making.
    • Medical Devices: Serves as a core component in advanced medical imaging devices, enabling rapid data processing and thus supporting high-resolution, real-time imaging.
    • Industrial Automation: Integral to the control systems in automated production lines, improving efficiency and precision in manufacturing processes.
    This HTML content effectively presents the product in a professional and engaging manner, tailored to attract B2B customers interested in purchasing the FPGAs AMD Xilinx XCKU3P-3FFVA676E in bulk.
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    Shipping Cost

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