XCKU3P-2SFVB784E

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Mfr.Part #
XCKU3P-2SFVB784E
Manufacturer
AMD Xilinx
Package / Case
784-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 304 I/O 784FCBGA
Stock
5,750
In Stock :
5,750

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
20340
Number of I/O :
304
Package / Case :
784-BBGA, FCBGA
Packaging :
Bulk
Operating Temperature :
0°C~100°C TJ
Factory Lead Time :
11 Weeks
Total RAM Bits :
31641600
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Reach Compliance Code :
Compliant
RoHS Status :
RoHS Compliant
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Logic Elements/Cells :
355950
Voltage - Supply :
0.825V~0.876V
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Series :
Kintex® UltraScale+™
Mounting Type :
Surface Mount
JESD-609 Code :
e1
HTS Code :
8542.39.00.01
Datasheets
XCKU3P-2SFVB784E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-2SFVB784E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:784-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, Mounting Type:Surface Mount, XCKU3P-2SFVB784E pinout, XCKU3P-2SFVB784E datasheet PDF, XCKU3P-2SFVB784E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-2SFVB784E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU3P-2SFVB784E


FPGAs AMD Xilinx XCKU3P-2SFVB784E Overview

The AMD Xilinx XCKU3P-2SFVB784E FPGA represents a cutting-edge solution in the field of programmable logic devices, designed to meet the demanding requirements of modern embedded systems. As a high-performance FPGA from AMD Xilinx, this component is engineered to offer superior flexibility and speed, making it an ideal choice for designers aiming to develop complex digital circuits with a reprogrammable facility. The 784-pin FCBGA (Flip Chip Ball Grid Array) package efficiently addresses the challenges of heat dissipation and space constraints in densely packed electronic assemblies, making it a robust choice for advanced applications.

XCKU3P-2SFVB784E Features

The XCKU3P-2SFVB784E FPGA boasts a robust feature set including 304 user I/O pins which provide ample flexibility for interfacing with a wide range of peripherals and other digital systems. This device is built to support high-speed data transfer and high-frequency operation, crucial for real-time applications. It also features low-power consumption despite its high functionality, making it suitable for energy-sensitive projects.

XCKU3P-2SFVB784E Applications

  • Data Centers: Used in server farms and networking equipment to manage data flow efficiently and ensure high-speed data processing.
  • Telecommunications: Implemented in communication infrastructure to support complex signal processing tasks and enhance bandwidth management.
  • Automotive: Deployed in advanced driver-assistance systems (ADAS) to process real-time signals and control automotive electronics.
  • Industrial Automation: Applied in control systems for managing machinery operations, ensuring precision and reliability in harsh environments.
  • Aerospace and Defense: Utilized in avionics and military hardware for navigation systems, radar and secure communications.
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