XCKU3P-2FFVD900I
- Mfr.Part #
- XCKU3P-2FFVD900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 304 I/O 900FCBGA
- Stock
- 46,948
- In Stock :
- 46,948
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Mounting Type :
- Surface Mount
- Package / Case :
- 900-BBGA, FCBGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits :
- 31641600
- Packaging :
- Tray
- Number of I/O :
- 304
- HTS Code :
- 8542.39.00.01
- Voltage - Supply :
- 0.825V~0.876V
- Number of Logic Elements/Cells :
- 355950
- Number of LABs/CLBs :
- 20340
- Series :
- Kintex® UltraScale+™
- RoHS Status :
- ROHS3 Compliant
- Operating Temperature :
- -40°C~100°C TJ
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Factory Lead Time :
- 11 Weeks
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Datasheets
- XCKU3P-2FFVD900I

FPGAs AMD Xilinx XCKU3P-2FFVD900I Overview
Introducing the AMD Xilinx XCKU3P-2FFVD900I, a high-performance IC FPGA (Field Programmable Gate Array) that embodies cutting-edge technology for versatile applications in a 900FCBGA package. This FPGA is designed to meet the demanding needs of modern digital circuits with its robust I/O capabilities and advanced features. The XCKU3P-2FFVD900I is optimized for power efficiency and high-speed performance, making it an ideal choice for developers looking to push the boundaries of hardware acceleration, signal processing, and system integration.
XCKU3P-2FFVD900I Features
The XCKU3P-2FFVD900I FPGA from AMD Xilinx offers 304 I/O pins, which are crucial for multifaceted interfacing and connectivity options in complex electronics. Housed in a compact 900FCBGA package, it ensures a minimized footprint on system boards, facilitating easier integration into existing designs. The device is known for its high reliability and is ideally suited for environments requiring industrial-grade temperature specifications.
XCKU3P-2FFVD900I Applications
- Data Centers: Utilizes its high I/O count and processing capabilities to manage and accelerate data-intensive tasks, enhancing overall efficiency and performance in server applications.
- Telecommunications: Supports complex signal processing tasks for base station development and other communication infrastructure, ensuring robust and flexible network operations.
- Automotive: Ideal for driver assistance systems (ADAS) where real-time data processing and reliability are crucial.
- Medical Imaging: Helps in the processing of complex imaging algorithms, crucial in devices such as MRI and ultrasound scanners, improving image quality and processing speed.
- Industrial Automation: Can be integrated into control systems to enhance automation processes, ensuring high-speed data transmission and real-time system monitoring.
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