XCKU3P-2FFVD900I

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Mfr.Part #
XCKU3P-2FFVD900I
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 304 I/O 900FCBGA
Stock
46,948
In Stock :
46,948

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Mounting Type :
Surface Mount
Package / Case :
900-BBGA, FCBGA
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
31641600
Packaging :
Tray
Number of I/O :
304
HTS Code :
8542.39.00.01
Voltage - Supply :
0.825V~0.876V
Number of Logic Elements/Cells :
355950
Number of LABs/CLBs :
20340
Series :
Kintex® UltraScale+™
RoHS Status :
ROHS3 Compliant
Operating Temperature :
-40°C~100°C TJ
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Factory Lead Time :
11 Weeks
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Datasheets
XCKU3P-2FFVD900I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-2FFVD900I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:900-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, XCKU3P-2FFVD900I pinout, XCKU3P-2FFVD900I datasheet PDF, XCKU3P-2FFVD900I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-2FFVD900I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU3P-2FFVD900I


FPGAs AMD Xilinx XCKU3P-2FFVD900I Overview

Introducing the AMD Xilinx XCKU3P-2FFVD900I, a high-performance IC FPGA (Field Programmable Gate Array) that embodies cutting-edge technology for versatile applications in a 900FCBGA package. This FPGA is designed to meet the demanding needs of modern digital circuits with its robust I/O capabilities and advanced features. The XCKU3P-2FFVD900I is optimized for power efficiency and high-speed performance, making it an ideal choice for developers looking to push the boundaries of hardware acceleration, signal processing, and system integration.

XCKU3P-2FFVD900I Features

The XCKU3P-2FFVD900I FPGA from AMD Xilinx offers 304 I/O pins, which are crucial for multifaceted interfacing and connectivity options in complex electronics. Housed in a compact 900FCBGA package, it ensures a minimized footprint on system boards, facilitating easier integration into existing designs. The device is known for its high reliability and is ideally suited for environments requiring industrial-grade temperature specifications.

XCKU3P-2FFVD900I Applications

  • Data Centers: Utilizes its high I/O count and processing capabilities to manage and accelerate data-intensive tasks, enhancing overall efficiency and performance in server applications.
  • Telecommunications: Supports complex signal processing tasks for base station development and other communication infrastructure, ensuring robust and flexible network operations.
  • Automotive: Ideal for driver assistance systems (ADAS) where real-time data processing and reliability are crucial.
  • Medical Imaging: Helps in the processing of complex imaging algorithms, crucial in devices such as MRI and ultrasound scanners, improving image quality and processing speed.
  • Industrial Automation: Can be integrated into control systems to enhance automation processes, ensuring high-speed data transmission and real-time system monitoring.
This HTML content is crafted to highlight the features and potential applications of the AMD Xilinx XCKU3P-2FFVD900I FPGA, structured in a way to appeal to B2B customers and showcase its versatility and performance capabilities.
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