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  6. XCKU3P-2FFVD900E
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    XCKU3P-2FFVD900E

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    Mfr.Part #
    XCKU3P-2FFVD900E
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC FPGA 304 I/O 900FCBGA
    Stock
    1
    In Stock ：
    1

    Request A Quote(RFQ)

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    * Quantity:
    Manufacturer :
    AMD Xilinx
    Product Category :
    FPGAs (Field Programmable Gate Array)
    Number of LABs/CLBs :
    20340
    Number of Logic Elements/Cells :
    355950
    Package / Case :
    900-BBGA, FCBGA
    Total RAM Bits :
    31641600
    RoHS Status :
    ROHS3 Compliant
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Terminal Finish :
    Tin/Silver/Copper (Sn/Ag/Cu)
    Operating Temperature :
    0°C~100°C TJ
    Number of I/O :
    304
    Series :
    Kintex® UltraScale+™
    Pbfree Code :
    yes
    HTS Code :
    8542.39.00.01
    Voltage - Supply :
    0.825V~0.876V
    Mounting Type :
    Surface Mount
    JESD-609 Code :
    e1
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Programmable Logic Type :
    FIELD PROGRAMMABLE GATE ARRAY
    Factory Lead Time :
    11 Weeks
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Packaging :
    Tray
    Datasheets
    XCKU3P-2FFVD900E
    Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-2FFVD900E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：900-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, Mounting Type：Surface Mount, XCKU3P-2FFVD900E pinout, XCKU3P-2FFVD900E datasheet PDF, XCKU3P-2FFVD900E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-2FFVD900E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCKU3P-2FFVD900E


    FPGAs AMD Xilinx XCKU3P-2FFVD900E Overview

    The AMD Xilinx XCKU3P-2FFVD900E FPGA stands as a pinnacle of innovation in the field of programmable logic devices. Designed to cater to the demanding needs of modern digital applications, this FPGA offers a versatile platform for developing complex digital circuits with its 304 I/O pins housed in a 900FCBGA package. Its robust design and cutting-edge technology facilitate rapid prototyping and deployment of electronics, making it an essential component in a wide range of industrial applications. The FPGAs AMD Xilinx XCKU3P-2FFVD900E is specifically engineered to enhance performance, minimize power consumption, and provide maximal programmability, positioning itself as a premier choice for developers and engineers looking to push the boundaries of technology.

    XCKU3P-2FFVD900E Features

    This FPGA is packed with features designed to provide a high level of flexibility and functionality:

    • High I/O Count: Equipped with 304 I/O pins, it allows for extensive interfacing with a wide range of external devices.
    • Advanced Package: Utilizing a 900FCBGA package, it ensures reliable connectivity and robust physical integrity.
    • Programmability: Offers exceptional adaptability to changes in design specifications or functional requirements, simplifying iterations and upgrades.
    • Energy Efficiency: Designed for optimized power consumption, making it ideal for applications where efficiency is paramount.

    XCKU3P-2FFVD900E Applications

    • Data Centers: Used in the infrastructure of data centers for handling complex computations and data processing tasks efficiently.
    • Telecommunications: Employs in telecommunications equipment to manage signal processing and data transmission with high reliability and low latency.
    • Automotive: Integral to advanced driver-assistance systems (ADAS), where real-time processing and decision-making are critical.
    • Medical Devices: Supports functionalities in medical imaging devices, enhancing the precision and speed of diagnostic procedures.
    • Industrial Automation: Drives automation equipment, contributing to increased productivity and operational safety in manufacturing environments.
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    Shipping Cost

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