XCKU3P-2FFVB676I
- Mfr.Part #
- XCKU3P-2FFVB676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 280 I/O 676FCBGA
- Stock
- 43,834
- In Stock :
- 43,834
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Total RAM Bits :
- 31641600
- HTS Code :
- 8542.39.00.01
- Series :
- Kintex® UltraScale+™
- Package / Case :
- 676-BBGA, FCBGA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Packaging :
- Tray
- Number of Logic Elements/Cells :
- 355950
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of I/O :
- 280
- Number of LABs/CLBs :
- 20340
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Operating Temperature :
- -40°C~100°C TJ
- RoHS Status :
- ROHS3 Compliant
- Factory Lead Time :
- 11 Weeks
- Voltage - Supply :
- 0.825V~0.876V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- XCKU3P-2FFVB676I

FPGAs AMD Xilinx XCKU3P-2FFVB676I Overview
Introducing the XCKU3P-2FFVB676I from AMD Xilinx, a high-performance Field Programmable Gate Array (FPGA) designed to meet the demanding requirements of modern digital applications. This component is part of the UltraScale+ series, which provides not only a significant increase in performance but also improved power efficiency compared to previous generations. The FPGA features 280 I/O ports and is packaged in a 676-pin flip-chip ball grid array (FCBGA), making it highly suitable for dense and compact hardware designs. The FPGAs AMD Xilinx XCKU3P-2FFVB676I is engineered to deliver superior configurability and acceleration to a wide range of applications, making it an ideal choice for developers looking to push the boundaries of technology.
XCKU3P-2FFVB676I Features
The XCKU3P-2FFVB676I FPGA is equipped with a robust set of features designed for versatility and high performance. This includes a rich architecture capable of handling complex algorithms and processes, making it suitable for both high-speed data processing and precise control applications. Its 280 I/Os allow for extensive connectivity options, supporting a variety of digital and analog inputs and outputs. The device's advanced thermal management capabilities ensure reliable performance even under strenuous conditions, further underlined by its robust packaging designed to minimize physical vulnerabilities.
XCKU3P-2FFVB676I Applications
- Data Centers: Used for managing workloads through customizable acceleration technologies, which improve the efficiency and performance of data processing tasks.
- Telecommunications: Essential for processing and routing high volumes of data, aiding in network reliability and speed in both wired and wireless communication systems.
- Automotive Applications: Plays a critical role in driver assistance systems (ADAS) where real-time data processing is crucial for vehicle safety and navigation enhancements.
- Medical Devices: Supports advanced medical imaging technologies and diagnostic equipment, facilitating faster and more accurate analysis.
- Industrial Automation: Drives the backbone of smart factories, enhancing automation capabilities through improved control systems and operational efficiencies.
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