XCKU3P-2FFVB676E
- Mfr.Part #
- XCKU3P-2FFVB676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 280 I/O 676FCBGA
- Stock
- 48,657
- In Stock :
- 48,657
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Logic Elements/Cells :
- 355950
- Voltage - Supply :
- 0.825V~0.876V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pbfree Code :
- yes
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of LABs/CLBs :
- 20340
- Number of I/O :
- 280
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Packaging :
- Tray
- Total RAM Bits :
- 31641600
- Series :
- Kintex® UltraScale+™
- Factory Lead Time :
- 11 Weeks
- RoHS Status :
- ROHS3 Compliant
- HTS Code :
- 8542.39.00.01
- JESD-609 Code :
- e1
- Operating Temperature :
- 0°C~100°C TJ
- Package / Case :
- 676-BBGA, FCBGA
- Datasheets
- XCKU3P-2FFVB676E

FPGAs AMD Xilinx XCKU3P-2FFVB676E Overview
The AMD Xilinx XCKU3P-2FFVB676E represents a high-performance FPGA (Field Programmable Gate Array) solution, designed to cater to the demanding requirements of modern digital circuits. This advanced IC (Integrated Circuit) is built to deliver exceptional versatility with its configurable logic blocks, allowing for rapid prototyping and customization to specific application needs. Its integration into a 676FCBGA (Fine-Pitch Ball Grid Array) package ensures high density and reliability, making it an excellent choice for designers looking for scalable and efficient solutions in complex electronic environments. The FPGAs AMD Xilinx XCKU3P-2FFVB676E is ideal for applications requiring substantial I/O capabilities, given its 280 I/O ports, which facilitate wide interfacing with other digital systems.
XCKU3P-2FFVB676E Features
This FPGA is equipped with advanced features that enhance its functionality and usability in various applications:
- 280 I/O Ports: Allows for extensive interfacing with other hardware components, ideal for systems requiring numerous connections.
- 676FCBGA Packaging: Provides a compact and robust form factor that is suitable for dense board configurations and high-reliability applications.
- High Configurability: The flexible architecture of the FPGA allows for easy customization to meet specific design requirements, which is critical in reducing development time and cost.
- Scalability: Suitable for both small-scale prototypes and large-scale production, adapting easily as project needs evolve.
XCKU3P-2FFVB676E Applications
- Data Centers: Utilized in server farms to manage data flow efficiently, ensuring high-speed data processing and reduced latency.
- Telecommunications: Critical in communication infrastructure for signal processing and data transmission, enhancing bandwidth and reducing errors.
- Automotive: Applied in vehicle electronics for controlling systems like advanced driver-assistance systems (ADAS), improving safety and performance.
- Medical Devices: Used in medical imaging systems to process complex algorithms rapidly, aiding in faster and more accurate diagnoses.
- Aerospace: Helps in satellite communication systems by facilitating robust and reliable data handling capabilities under extreme conditions.
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