XCKU3P-2FFVA676E

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Mfr.Part #
XCKU3P-2FFVA676E
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 256 I/O 676FCBGA
Stock
33,988
In Stock :
33,988

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
JESD-609 Code :
e1
Total RAM Bits :
31641600
Operating Temperature :
0°C~100°C TJ
Package / Case :
676-BBGA, FCBGA
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Factory Lead Time :
11 Weeks
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Voltage - Supply :
0.825V~0.876V
Number of I/O :
256
HTS Code :
8542.39.00.01
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Packaging :
Tray
Mounting Type :
Surface Mount
Number of LABs/CLBs :
20340
Pbfree Code :
yes
RoHS Status :
ROHS3 Compliant
Number of Logic Elements/Cells :
355950
Series :
Kintex® UltraScale+™
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Datasheets
XCKU3P-2FFVA676E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-2FFVA676E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Package / Case:676-BBGA, FCBGA, Mounting Type:Surface Mount, XCKU3P-2FFVA676E pinout, XCKU3P-2FFVA676E datasheet PDF, XCKU3P-2FFVA676E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-2FFVA676E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU3P-2FFVA676E


FPGAs AMD Xilinx XCKU3P-2FFVA676E Overview

The AMD Xilinx XCKU3P-2FFVA676E is a highly versatile and powerful FPGA (Field Programmable Gate Array) that delivers exceptional performance and flexibility for a wide range of applications. Designed for advanced systems requiring high-speed data processing and I/O agility, this FPGA features a robust 676-pin FCBGA (Flip-Chip Ball Grid Array) package, enabling compact and efficient integration into hardware setups. With 256 I/O options, the XCKU3P-2FFVA676E facilitates expansive connectivity, making it an ideal choice for developers and engineers looking to push the boundaries of technology in their respective fields.

XCKU3P-2FFVA676E Features

This FPGA model boasts several features that make it stand out in the industry. It supports high-speed data transmission and sophisticated signal processing capabilities, which are essential for handling complex algorithms and large data sets efficiently. The device's scalability and configurability allow for customization to specific project needs, enhancing its utility in diverse technological landscapes.

XCKU3P-2FFVA676E Applications

  • Data Centers: Utilized for managing high-speed data operations and improving server efficiency, ensuring faster data processing and reduced latency in network operations.
  • Telecommunications: Employs advanced signal processing capabilities to handle high-frequency communications and data transmission, enhancing bandwidth and reducing signal interference.
  • Aerospace and Defense: Critical for applications requiring high levels of data security and computational power to perform real-time processing on complex datasets, such as in navigation and surveillance systems.
  • Automotive: Supports advanced driver-assistance systems (ADAS) by processing multiple inputs simultaneously, helping to improve vehicle safety and performance.
  • Industrial Automation: Optimizes control systems and process automation, enabling more efficient production lines and reduced operational costs.
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