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  6. XCKU3P-1FFVB676I
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    XCKU3P-1FFVB676I

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    Mfr.Part #
    XCKU3P-1FFVB676I
    Manufacturer
    AMD Xilinx
    Package / Case
    676-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC FPGA 280 I/O 676FCBGA
    Stock
    11,102
    In Stock ：
    11,102

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    Manufacturer :
    AMD Xilinx
    Product Category :
    FPGAs (Field Programmable Gate Array)
    Series :
    Kintex® UltraScale+™
    Factory Lead Time :
    11 Weeks
    Operating Temperature :
    -40°C~100°C TJ
    Voltage - Supply :
    0.825V~0.876V
    Number of LABs/CLBs :
    20340
    Number of Logic Elements/Cells :
    355950
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Package / Case :
    676-BBGA, FCBGA
    Mounting Type :
    Surface Mount
    Packaging :
    Tray
    Number of I/O :
    280
    RoHS Status :
    ROHS3 Compliant
    HTS Code :
    8542.39.00.01
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Programmable Logic Type :
    FIELD PROGRAMMABLE GATE ARRAY
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Total RAM Bits :
    31641600
    Datasheets
    XCKU3P-1FFVB676I
    Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-1FFVB676I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C~100°C TJ, Package / Case：676-BBGA, FCBGA, Mounting Type：Surface Mount, XCKU3P-1FFVB676I pinout, XCKU3P-1FFVB676I datasheet PDF, XCKU3P-1FFVB676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-1FFVB676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCKU3P-1FFVB676I


    FPGAs AMD Xilinx XCKU3P-1FFVB676I Overview

    Introducing the AMD Xilinx XCKU3P-1FFVB676I, a cutting-edge FPGA (Field Programmable Gate Array) that delivers high-performance and versatility for a wide range of applications. This powerful IC is designed to meet the rigorous demands of today's complex digital systems. Built on a robust platform, the XCKU3P-1FFVB676I offers 280 I/O options housed in a compact 676-FCBGA package, ensuring a perfect blend of connectivity and functionality. The chip is ideal for designers looking for high-speed integration capabilities with the reliability and innovation expected from AMD Xilinx, a leader in FPGA technology.

    XCKU3P-1FFVB676I Features

    The XCKU3P-1FFVB676I FPGA is equipped with advanced features that enable it to perform in diverse environments and applications. It supports a variety of logic integration tasks, offering extensive I/O capabilities and a flexible configuration, all packaged in a highly efficient 676-pin FCBGA. This FPGA provides robust options for customization and scalability, making it an excellent choice for projects requiring high-speed data processing and precise electrical control.

    XCKU3P-1FFVB676I Applications

    • Data Centers: Utilized for managing high-speed data operations, improving the efficiency and reliability of data storage and access systems.
    • Telecommunications: Essential for developing communication equipment that requires high-speed signal processing capabilities to handle complex algorithms for 5G and other advanced communication protocols.
    • Automotive Systems: Enhances functionality in advanced driver-assistance systems (ADAS) by providing the necessary processing power to handle real-time sensor data and decision making.
    • Industrial Automation: Plays a pivotal role in controlling and managing automated machinery and processes, increasing productivity and safety in manufacturing environments.
    • Medical Devices: Key in the development of medical imaging systems, where high data throughput and precision are critical for accurate diagnostics.
    This HTML formatted response incorporates the product overview, features, and applications for the XCKU3P-1FFVB676I FPGA, aiming to be both informative and appealing to B2B customers.
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