XCKU3P-1FFVB676E
- Mfr.Part #
- XCKU3P-1FFVB676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 280 I/O 676FCBGA
- Stock
- 36,196
- In Stock :
- 36,196
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- RoHS Status :
- ROHS3 Compliant
- Series :
- Kintex® UltraScale+™
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Voltage - Supply :
- 0.825V~0.876V
- Factory Lead Time :
- 11 Weeks
- Package / Case :
- 676-BBGA, FCBGA
- Number of Logic Elements/Cells :
- 355950
- Number of I/O :
- 280
- HTS Code :
- 8542.39.00.01
- Total RAM Bits :
- 31641600
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- Number of LABs/CLBs :
- 20340
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Operating Temperature :
- 0°C~100°C TJ
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Datasheets
- XCKU3P-1FFVB676E

FPGAs AMD Xilinx XCKU3P-1FFVB676E Overview
The AMD Xilinx XCKU3P-1FFVB676E is a cutting-edge FPGA (Field Programmable Gate Array) designed to cater to the demanding needs of modern high-speed digital computing environments. This FPGA is part of the renowned Xilinx UltraScale series, which is famous for its high performance, flexibility, and the efficiency it brings to a variety of applications. With a robust 676-pin FCBGA (Flip-Chip Ball Grid Array) package, this product provides a solid foundation for designing and deploying advanced electronic systems. Its ability to handle up to 280 I/O points makes it incredibly versatile for both prototyping and full-scale production. The FPGAs AMD Xilinx XCKU3P-1FFVB676E is specifically engineered to boost performance, minimize latency, and reduce power consumption, making it an ideal choice for developers looking to push the boundaries of technology.
XCKU3P-1FFVB676E Features
The XCKU3P-1FFVB676E FPGA from AMD Xilinx offers several distinctive features that set it apart in the marketplace:
- High I/O Count: Supports up to 280 input/output terminals, providing extensive connectivity for complex applications.
- Advanced Packaging: Utilizes a 676-pin FCBGA package, ensuring robust and reliable interconnections.
- UltraScale Architecture: Leverages Xilinx's UltraScale architecture that delivers significant improvements in performance and power efficiency.
- Scalability: Designed for scalability and high-performance, suitable for both small-scale prototypes and large-volume production.
- Energy Efficiency: Optimized for low power consumption, enhancing overall system sustainability.
XCKU3P-1FFVB676E Applications
- Data Centers: Used in high-performance servers and storage solutions to manage and process large volumes of data with high throughput and low latency.
- Telecommunications: Ideal for telecommunications equipment, such as routers and switches, where high-speed signal processing is crucial.
- Automotive: Can be integrated into automotive systems for advanced driver-assistance systems (ADAS) that require real-time processing.
- Medical Devices: Applicable in medical imaging systems, where FPGA can process complex imaging algorithms swiftly and efficiently.
- Industrial Automation: Perfect for control systems in manufacturing processes that demand precise, real-time operations.
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