XCKU3P-1FFVB676E

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Mfr.Part #
XCKU3P-1FFVB676E
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 280 I/O 676FCBGA
Stock
36,196
In Stock :
36,196

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
RoHS Status :
ROHS3 Compliant
Series :
Kintex® UltraScale+™
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Voltage - Supply :
0.825V~0.876V
Factory Lead Time :
11 Weeks
Package / Case :
676-BBGA, FCBGA
Number of Logic Elements/Cells :
355950
Number of I/O :
280
HTS Code :
8542.39.00.01
Total RAM Bits :
31641600
Mounting Type :
Surface Mount
Packaging :
Tray
Number of LABs/CLBs :
20340
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
0°C~100°C TJ
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Datasheets
XCKU3P-1FFVB676E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-1FFVB676E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, XCKU3P-1FFVB676E pinout, XCKU3P-1FFVB676E datasheet PDF, XCKU3P-1FFVB676E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU3P-1FFVB676E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU3P-1FFVB676E


FPGAs AMD Xilinx XCKU3P-1FFVB676E Overview

The AMD Xilinx XCKU3P-1FFVB676E is a cutting-edge FPGA (Field Programmable Gate Array) designed to cater to the demanding needs of modern high-speed digital computing environments. This FPGA is part of the renowned Xilinx UltraScale series, which is famous for its high performance, flexibility, and the efficiency it brings to a variety of applications. With a robust 676-pin FCBGA (Flip-Chip Ball Grid Array) package, this product provides a solid foundation for designing and deploying advanced electronic systems. Its ability to handle up to 280 I/O points makes it incredibly versatile for both prototyping and full-scale production. The FPGAs AMD Xilinx XCKU3P-1FFVB676E is specifically engineered to boost performance, minimize latency, and reduce power consumption, making it an ideal choice for developers looking to push the boundaries of technology.

XCKU3P-1FFVB676E Features

The XCKU3P-1FFVB676E FPGA from AMD Xilinx offers several distinctive features that set it apart in the marketplace:

  • High I/O Count: Supports up to 280 input/output terminals, providing extensive connectivity for complex applications.
  • Advanced Packaging: Utilizes a 676-pin FCBGA package, ensuring robust and reliable interconnections.
  • UltraScale Architecture: Leverages Xilinx's UltraScale architecture that delivers significant improvements in performance and power efficiency.
  • Scalability: Designed for scalability and high-performance, suitable for both small-scale prototypes and large-volume production.
  • Energy Efficiency: Optimized for low power consumption, enhancing overall system sustainability.

XCKU3P-1FFVB676E Applications

  • Data Centers: Used in high-performance servers and storage solutions to manage and process large volumes of data with high throughput and low latency.
  • Telecommunications: Ideal for telecommunications equipment, such as routers and switches, where high-speed signal processing is crucial.
  • Automotive: Can be integrated into automotive systems for advanced driver-assistance systems (ADAS) that require real-time processing.
  • Medical Devices: Applicable in medical imaging systems, where FPGA can process complex imaging algorithms swiftly and efficiently.
  • Industrial Automation: Perfect for control systems in manufacturing processes that demand precise, real-time operations.
This HTML content is designed to highlight the features and potential applications of the XCKU3P-1FFVB676E FPGA, positioning it effectively for B2B clients and industry professionals looking for robust, scalable, and efficient electronic components.
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