XCKU19P-L2FFVJ1760E
- Mfr.Part #
- XCKU19P-L2FFVJ1760E
- Manufacturer
- AMD Xilinx
- Package / Case
- BGA-1760
- Datasheet
- Download
- Description
- IC FPGA KINTEX UP LP 1760FCBGA
- Stock
- 12,306
- In Stock :
- 12,306
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Maximum Operating Temperature :
- + 110 C
- Number of I/Os :
- 572 I/O
- Voltage - Supply :
- 0.698V ~ 0.742V
- Number of LABs/CLBs :
- 105300
- Mounting Style :
- SMD/SMT
- Number of Transceivers :
- 32 Transceiver
- Minimum Operating Temperature :
- 0 C
- Supplier Device Package :
- 1760-FCBGA (42.5x42.5)
- Number of I/O :
- 540
- Product Status :
- Active
- Data Rate :
- 6 Gb/s
- Series :
- XCKU19P
- Package :
- Tray
- Operating Temperature :
- 0°C ~ 110°C (TJ)
- Number of Logic Elements/Cells :
- 1842750
- Package / Case :
- BGA-1760
- Operating Supply Voltage :
- 850 mV
- Mounting Type :
- Surface Mount
- Total RAM Bits :
- 63753421
- Datasheets
- XCKU19P-L2FFVJ1760E

FPGAs AMD Xilinx XCKU19P-L2FFVJ1760E Overview
The AMD Xilinx XCKU19P-L2FFVJ1760E FPGA is a high-performance, low-power field programmable gate array part of the Kintex UltraScale family. This product is specifically designed to meet the increasing demands of high-speed data processing and high-throughput applications. With its advanced architecture, the XCKU19P-L2FFVJ1760E delivers optimal power efficiency and increased performance density, which makes it an ideal choice for a wide range of industrial, commercial, and communication devices. Its integration capabilities in a 1760-pin flip-chip BGA package ensure robustness and ease of deployment, enhancing system reliability and scalability.
XCKU19P-L2FFVJ1760E Features
This FPGA features a versatile and adaptable architecture that supports various programming technologies and interfaces. Key features include advanced DSP slices for intensive computations, high-speed transceivers for enhanced data transmission, and ample logic cells that enable complex digital integrations. Additionally, its support for PCI Express Gen3x16 aligns with the needs for high-speed data transfer in compute-intensive applications, solidifying its role in next-generation embedded systems.
XCKU19P-L2FFVJ1760E Applications
- Data Centers: Enhances data processing capabilities with high-speed interfaces and extensive data handling capacities.
- Telecommunications: Supports high bandwidth requirements for 5G infrastructure through its high-speed transceivers and powerful signal processing abilities.
- Automotive: Used in advanced driver-assistance systems (ADAS) to process multiple inputs from sensors and cameras efficiently.
- Video Surveillance: Facilitates real-time video analytics and processing, ensuring higher security through faster image processing and analysis.
- Medical Imaging: Ideal for handling complex algorithms required in medical imaging equipment such as MRIs and CT scanners, improving diagnostic capabilities.
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