XCKU19P-3FFVJ1760E

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Mfr.Part #
XCKU19P-3FFVJ1760E
Manufacturer
AMD Xilinx
Package / Case
BGA-1760
Datasheet
Download
Description
IC FPGA KINTEX UP 1760FCBGA
Stock
25,946
In Stock :
25,946

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
BGA-1760
Operating Supply Voltage :
900 mV
Number of LABs/CLBs :
105300
Minimum Operating Temperature :
0 C
Product Status :
Active
Number of I/Os :
572 I/O
Mounting Type :
Surface Mount
Number of I/O :
540
Supplier Device Package :
1760-FCBGA (42.5x42.5)
Maximum Operating Temperature :
+ 100 C
Voltage - Supply :
0.873V ~ 0.927V
Total RAM Bits :
63753421
Operating Temperature :
0°C ~ 100°C (TJ)
Number of Logic Elements/Cells :
1842750
Series :
XCKU19P
Mounting Style :
SMD/SMT
Data Rate :
6 Gb/s
Number of Transceivers :
32 Transceiver
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU19P-3FFVJ1760E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:BGA-1760, Mounting Type:Surface Mount, Operating Temperature:0°C ~ 100°C (TJ), XCKU19P-3FFVJ1760E pinout, XCKU19P-3FFVJ1760E datasheet PDF, XCKU19P-3FFVJ1760E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU19P-3FFVJ1760E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU19P-3FFVJ1760E


FPGAs AMD Xilinx XCKU19P-3FFVJ1760E Overview

The FPGAs AMD Xilinx XCKU19P-3FFVJ1760E represents a cutting-edge solution in the realm of programmable logic devices. This particular model from AMD Xilinx stands out due to its integration within the Kintex UltraScale series, tailored for high-performance applications that require exceptional processing power and speed. With its deployment in a 1760-pin FCBGA package, this FPGA facilitates complex digital computations while maintaining a balance of power efficiency and cost-effectiveness, making it an ideal choice for businesses looking to scale their operations. Incorporating the FPGAs AMD Xilinx XCKU19P-3FFVJ1760E into your systems ensures a robust platform capable of adapting to evolving technological demands.

XCKU19P-3FFVJ1760E Features

The XCKU19P-3FFVJ1760E FPGA is engineered to deliver superior performance. Key features include advanced digital signal processing (DSP) capabilities, a high count of logic cells, and substantial I/O options. These features make it highly adaptable for varying design requirements. Its high integration supports complex algorithms and processes necessary for modern digital workflows, ensuring efficiency and reliability.

XCKU19P-3FFVJ1760E Applications

  • Data Centers: This FPGA excels in managing intensive computations and high-speed data operations, making it perfect for server applications and network infrastructure in data centers.
  • Telecommunications: The XCKU19P-3FFVJ1760E is ideal for processing large amounts of data with low latency, crucial for telecom network management, signal processing, and infrastructure support.
  • Aerospace and Defense: Its robust processing capabilities and resistance to harsh environments make it suitable for aerospace and defense applications, where reliability and precision are paramount.
  • Medical Imaging: Leveraging its advanced DSP capabilities, this FPGA can handle complex algorithms required for medical imaging technologies, enhancing the clarity and speed of imaging processes.
  • Industrial Automation: In industrial settings, the FPGA’s ability to process multiple inputs and outputs simultaneously enables enhanced automation and control systems, leading to increased productivity and efficiency.
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