XCKU19P-3FFVB2104E

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Mfr.Part #
XCKU19P-3FFVB2104E
Manufacturer
AMD Xilinx
Package / Case
BGA-2104
Datasheet
Download
Description
IC FPGA KINTEX UP 2104FCBGA
Stock
49,864
In Stock :
49,864

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
63753421
Number of I/O :
540
Data Rate :
6 Gb/s
Product Status :
Active
Package :
Tray
Operating Temperature :
0°C ~ 100°C (TJ)
Supplier Device Package :
2104-FCBGA (47.5x47.5)
Number of I/Os :
572 I/O
Operating Supply Voltage :
900 mV
Series :
XCKU19P
Minimum Operating Temperature :
0 C
Maximum Operating Temperature :
+ 100 C
Number of Logic Elements/Cells :
1842750
Mounting Style :
SMD/SMT
Mounting Type :
Surface Mount
Number of LABs/CLBs :
105300
Package / Case :
BGA-2104
Number of Transceivers :
32 Transceiver
Voltage - Supply :
0.873V ~ 0.927V
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU19P-3FFVB2104E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C ~ 100°C (TJ), Mounting Type:Surface Mount, Package / Case:BGA-2104, XCKU19P-3FFVB2104E pinout, XCKU19P-3FFVB2104E datasheet PDF, XCKU19P-3FFVB2104E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU19P-3FFVB2104E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU19P-3FFVB2104E


FPGAs AMD Xilinx XCKU19P-3FFVB2104E Overview

The FPGAs AMD Xilinx XCKU19P-3FFVB2104E is a cutting-edge field-programmable gate array (FPGA) that brings exceptional processing power and flexibility to a wide range of applications. Designed by AMD Xilinx, a leader in digital design and integration, this IC FPGA KINTEX UP device is housed in a 2104FCBGA package, making it ideal for advanced embedded systems requiring high-speed data processing and high-performance logic operations. With its robust configurability and powerful architecture, the XCKU19P-3FFVB2104E is engineered to meet the rigorous demands of modern technology environments, empowering developers to achieve new levels of performance and innovation.

XCKU19P-3FFVB2104E Features

The XCKU19P-3FFVB2104E FPGA features include its high-density integration capable of supporting complex algorithms and multitasking environments. The device offers substantial logic density enhancements, increased I/O bandwidth, and a flexible memory architecture, which are essential for handling large-scale integration on a single chip. Furthermore, its advanced security protocols ensure safe and reliable operation in critical applications.

XCKU19P-3FFVB2104E Applications

  • Telecommunications: The FPGA can be used to manage signal processing and data flow in high-speed communication infrastructures, improving the efficiency and reliability of network systems.
  • Data Centers: This FPGA excels in handling rapid data processing tasks, which are crucial for server operations and cloud computing services in data centers.
  • Automotive: Applied in driver assistance systems, the XCKU19P-3FFVB2104E helps in real-time sensor data processing and decision-making critical for safety features.
  • Aerospace and Defense: With its high reliability and adaptability, the FPGA serves as a core component for navigation and control systems in aerospace applications, ensuring robust performance even in harsh environments.
  • Industrial Automation: In industrial settings, the device supports complex machine control systems, contributing to enhanced automation and production efficiency.
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