XCKU19P-2FFVJ1760E

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Mfr.Part #
XCKU19P-2FFVJ1760E
Manufacturer
AMD Xilinx
Package / Case
BGA-1760
Datasheet
Download
Description
IC FPGA KINTEX UP 1760FCBGA
Stock
40,096
In Stock :
40,096

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Series :
XCKU19P
Minimum Operating Temperature :
0 C
Operating Temperature :
0°C ~ 100°C (TJ)
Number of Transceivers :
32 Transceiver
Number of Logic Elements/Cells :
1842750
Package / Case :
BGA-1760
Number of LABs/CLBs :
105300
Maximum Operating Temperature :
+ 100 C
Mounting Style :
SMD/SMT
Number of I/O :
540
Number of I/Os :
572 I/O
Data Rate :
6 Gb/s
Operating Supply Voltage :
850 mV
Product Status :
Active
Package :
Tray
Total RAM Bits :
63753421
Voltage - Supply :
0.825V ~ 0.876V
Supplier Device Package :
1760-FCBGA (42.5x42.5)
Mounting Type :
Surface Mount
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU19P-2FFVJ1760E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C ~ 100°C (TJ), Package / Case:BGA-1760, Mounting Type:Surface Mount, XCKU19P-2FFVJ1760E pinout, XCKU19P-2FFVJ1760E datasheet PDF, XCKU19P-2FFVJ1760E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU19P-2FFVJ1760E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU19P-2FFVJ1760E


FPGAs AMD Xilinx XCKU19P-2FFVJ1760E Overview

The FPGAs AMD Xilinx XCKU19P-2FFVJ1760E is a high-performance, field-programmable gate array part of the Kintex UltraScale series. Designed for advanced systems requiring exceptional processing speed and flexibility, this IC offers a robust platform for developing complex digital circuits with ease. Ideal for applications demanding high-speed data processing and real-time analytics, the XCKU19P-2FFVJ1760E excels in delivering high functionality and adaptability. Its 1760-pin count in a fine-pitch BGA package ensures dense and efficient layout for space-constrained applications, making it a top choice for industry professionals seeking powerful FPGA solutions.

XCKU19P-2FFVJ1760E Features

This FPGA is built to meet the demands of modern high-speed, complex digital environments. Key features include advanced DSP slices for high-performance signal processing, a high number of logic cells facilitating complex designs, and efficient power management for reduced operational costs. The part's compatibility with multi-gigabit transceivers enhances its usability in high-throughput systems, while its programmability in hardware language such as VHDL and Verilog allows for flexible hardware customization.

XCKU19P-2FFVJ1760E Applications

  • Data Centers: Utilized for accelerating data processing and virtualization functions, enhancing server efficiency and network operations.
  • Telecommunications: Key component in network infrastructure to manage and route high volumes of data, improving bandwidth and reducing latency.
  • Medical Imaging: Helps in the rapid processing of complex imaging algorithms, critical for real-time diagnostic imaging systems such as MRI and CT scanners.
  • Automotive: Used in driver assistance systems to process inputs from multiple sensors for real-time decision making, crucial for safety and performance enhancements.
  • Aerospace and Defense: Integral in navigation and communication systems, ensuring reliability and precision in critical missions and operations.
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