XCKU15P-1FFVE1760E

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Mfr.Part #
XCKU15P-1FFVE1760E
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 668 I/O 1760FCBGA
Stock
25,588
In Stock :
25,588

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
65340
Factory Lead Time :
11 Weeks
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Operating Temperature :
0°C~100°C TJ
Height :
3.71mm
Voltage - Supply :
0.825V~0.876V
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of I/O :
668
Mounting Type :
Surface Mount
Packaging :
Tray
Package / Case :
1760-BBGA, FCBGA
Max Junction Temperature (Tj) :
100°C
Speed Grade :
1
Memory Type :
Flash
Number of Logic Elements/Cells :
1143450
Total RAM Bits :
82329600
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Series :
Kintex® UltraScale+™
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU15P-1FFVE1760E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Mounting Type:Surface Mount, Package / Case:1760-BBGA, FCBGA, XCKU15P-1FFVE1760E pinout, XCKU15P-1FFVE1760E datasheet PDF, XCKU15P-1FFVE1760E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU15P-1FFVE1760E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



FPGAs Kintex® UltraScale+™ Series 1760-BBGA, FCBGA

XCKU15P-1FFVE1760E Overview


The package that contains this software is called 1760-BBGA, FCBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 668 I/Os for better data transfer. In order to construct a fundamental building block, 1143450 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 0.825V~0.876V battery. There are many types of FPGAs in the Kintex® UltraScale+™ series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 82329600. 65340 LABs/CLBs are configured on this FPGA. This memory is designed for storing data and avoiding resource conflicts.

XCKU15P-1FFVE1760E Features


668 I/Os
Up to 82329600 RAM bits


XCKU15P-1FFVE1760E Applications


There are a lot of Xilinx Inc.
XCKU15P-1FFVE1760E FPGAs applications.


  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
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