XCKU13P-3FFVE900E
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- Mfr.Part #
- XCKU13P-3FFVE900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 304 I/O 900FCBGA
- Stock
- 35,683
- In Stock ：
- 35,683
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Package / Case :
- 900-BBGA, FCBGA
- Total RAM Bits :
- 70656000
- Number of Logic Elements/Cells :
- 746550
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of LABs/CLBs :
- 42660
- Number of I/O :
- 304
- Voltage - Supply :
- 0.873V~0.927V
- Factory Lead Time :
- 11 Weeks
- Mounting Type :
- Surface Mount
- Series :
- Kintex® UltraScale+™
- HTS Code :
- 8542.39.00.01
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- RoHS Status :
- ROHS3 Compliant
- Operating Temperature :
- 0°C~100°C TJ
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- XCKU13P-3FFVE900E
FPGAs Kintex® UltraScale+™ Series 900-BBGA, FCBGA
XCKU13P-3FFVE900E Overview
This package is included in the 900-BBGA, FCBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 0.873V~0.927V . An FPGA belonging to the Kintex® UltraScale+™ series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 70656000 RAM bits in terms of its RAM si70656000e. An array of 42660 LABs/CLBs is built into the FPGA.
XCKU13P-3FFVE900E Features
304 I/Os
Up to 70656000 RAM bits
XCKU13P-3FFVE900E Applications
There are a lot of Xilinx Inc.
XCKU13P-3FFVE900E FPGAs applications.
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
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