XCKU11P-3FFVE1517E

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Mfr.Part #
XCKU11P-3FFVE1517E
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 512 I/O 1517FCBGA
Stock
37,196
In Stock :
37,196

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
1517-BBGA, FCBGA
Series :
Kintex® UltraScale+™
Factory Lead Time :
11 Weeks
Number of I/O :
512
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Logic Elements/Cells :
653100
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
53964800
Packaging :
Tray
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Voltage - Supply :
0.873V~0.927V
RoHS Status :
ROHS3 Compliant
Operating Temperature :
0°C~100°C TJ
Number of LABs/CLBs :
37320
HTS Code :
8542.39.00.01
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU11P-3FFVE1517E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1517-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~100°C TJ, XCKU11P-3FFVE1517E pinout, XCKU11P-3FFVE1517E datasheet PDF, XCKU11P-3FFVE1517E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU11P-3FFVE1517E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU11P-3FFVE1517E


FPGAs AMD Xilinx XCKU11P-3FFVE1517E Overview

Introducing the FPGAs AMD Xilinx XCKU11P-3FFVE1517E, a high-performance, field-programmable gate array designed to meet the demanding needs of modern digital circuits. Engineered by AMD Xilinx, this IC FPGA features a 1517-ball flip-chip ball grid array (FCBGA) package, ensuring robust physical integration and high reliability. With its extensive I/O capability of 512 inputs and outputs, this device is perfectly suited for applications requiring high-speed data processing and substantial interfacing activities. It offers system integrators the flexibility to design versatile and scalable hardware architectures in sectors ranging from telecommunications to advanced computing systems, making it an essential component for developing cutting-edge technology.

XCKU11P-3FFVE1517E Features

This FPGA model stands out with its ample I/O options and robust packaging, which are critical for complex digital interactions and high-density integrations. Key features include its large-scale integration capabilities, high-speed data transmission, and the adaptability provided by its programmable nature, allowing for customization to specific project requirements. The FCBGA packaging not only enhances the thermal management but also contributes to the reliability and durability of the deployment in harsh environments.

XCKU11P-3FFVE1517E Applications

  • Data Centers: Utilized in server farms and data centers, the XCKU11P-3FFVE1517E helps manage and accelerate data processing tasks, contributing to enhanced data throughput and server efficiency.
  • Telecommunications: Plays a pivotal role in communication infrastructure, facilitating high-speed signal processing and data flow management critical for modern telecommunications networks.
  • Medical Imaging: Applied in the field of medical diagnostics, this FPGA supports the complex computations required for advanced imaging techniques such as MRI and CT scans, improving image resolution and processing speed.
  • Automotive: Key in the development of automotive electronics, especially in systems requiring rapid data processing like advanced driver-assistance systems (ADAS) and autonomous vehicle sensors.
  • Industrial Automation: Integral to industrial automation systems, it supports machinery control and sensor data integration, leading to increased efficiency and precision in automated tasks.
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