XCKU11P-2FFVD900I

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Mfr.Part #
XCKU11P-2FFVD900I
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 408 I/O 900FCBGA
Stock
27,247
In Stock :
27,247

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
-40°C~100°C TJ
Series :
Kintex® UltraScale+™
Total RAM Bits :
53964800
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of LABs/CLBs :
37320
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Package / Case :
900-BBGA, FCBGA
Mounting Type :
Surface Mount
RoHS Status :
ROHS3 Compliant
HTS Code :
8542.39.00.01
Number of Logic Elements/Cells :
653100
Packaging :
Tray
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Factory Lead Time :
11 Weeks
Voltage - Supply :
0.825V~0.876V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of I/O :
408
Datasheets
XCKU11P-2FFVD900I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU11P-2FFVD900I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:900-BBGA, FCBGA, Mounting Type:Surface Mount, XCKU11P-2FFVD900I pinout, XCKU11P-2FFVD900I datasheet PDF, XCKU11P-2FFVD900I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU11P-2FFVD900I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU11P-2FFVD900I


FPGAs AMD Xilinx XCKU11P-2FFVD900I Overview

The AMD Xilinx XCKU11P-2FFVD900I FPGA represents a state-of-the-art integration of programmability and performance, tailored for high-end applications that demand reliable and efficient processing capabilities. As part of AMD Xilinx's renowned FPGA product line, this device offers an optimal balance of power consumption, cost, and form factor. Designed in a compact 900FCBGA package, it includes 408 I/Os, enabling robust interfacing options for diverse applications. The XCKU11P-2FFVD900I excels in delivering high-performance processing capabilities while maintaining low power consumption, making it an ideal choice for developers looking to push the boundaries of technology in their projects.

XCKU11P-2FFVD900I Features

The XCKU11P-2FFVD900I FPGA by AMD Xilinx is engineered to meet the rigorous demands of modern digital circuits. It offers a broad range of features including a dense layout of configurable logic blocks, high-speed DSP slices, and advanced memory interfaces. This combination enables the design and implementation of complex algorithms and systems within a single chip, significantly reducing development time and enhancing system reliability.

XCKU11P-2FFVD900I Applications

  • Data Centers: The high I/O count and advanced connectivity options make the XCKU11P-2FFVD900I suitable for data center applications, facilitating rapid data flow and high-speed communications between servers.
  • Medical Imaging: With its capability to process large streams of data efficiently, this FPGA can be integrated into medical imaging systems, such as MRI and CT scanners, enhancing image processing speeds and accuracy.
  • Automotive Driver Assistance Systems: The FPGA's robust processing power and ability to handle multiple data streams concurrently make it ideal for use in advanced driver-assistance systems (ADAS), improving vehicle safety and functionality.
  • Telecommunications: The XCKU11P-2FFVD900I is well-suited for telecommunications infrastructure, supporting high-speed signal processing tasks essential for 5G technology and beyond.
  • Aerospace and Defense: Its high reliability and capacity for handling complex algorithms are crucial for aerospace and defense applications, where performance and precision are non-negotiable.
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