XCKU11P-2FFVD900E
- Mfr.Part #
- XCKU11P-2FFVD900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 408 I/O 900FCBGA
- Stock
- 4,353
- In Stock :
- 4,353
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Logic Elements/Cells :
- 653100
- Operating Temperature :
- 0°C~100°C TJ
- Number of I/O :
- 408
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Mounting Type :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Series :
- Kintex® UltraScale+™
- Package / Case :
- 900-BBGA, FCBGA
- Factory Lead Time :
- 11 Weeks
- HTS Code :
- 8542.39.00.01
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- JESD-609 Code :
- e1
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Voltage - Supply :
- 0.825V~0.876V
- Total RAM Bits :
- 53964800
- Number of LABs/CLBs :
- 37320
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- XCKU11P-2FFVD900E

FPGAs AMD Xilinx XCKU11P-2FFVD900E Overview
The AMD Xilinx XCKU11P-2FFVD900E FPGA stands out in the field of programmable logic devices, offering unparalleled adaptability and performance for demanding applications. As part of the UltraScale series, this FPGA is designed to deliver high-speed connectivity and advanced signal processing capabilities in a compact 900FCBGA package. Ideal for B2B customers seeking high-performance solutions in data processing and hardware acceleration, this FPGA facilitates efficient design cycles with its flexible programmable logic. With its comprehensive features and robust I/O options, the FPGAs AMD Xilinx XCKU11P-2FFVD900E is a prime choice for developers and enterprises aiming to leverage agile and powerful computing architectures.
XCKU11P-2FFVD900E Features
This FPGA offers an impressive array of features suited for high-end applications. It houses 408 I/O pins, enabling extensive connectivity and interfacing options. The integration into a 900FCBGA package ensures a compact form factor that can fit into a variety of electronic assemblies. High configurability and a rich set of resources make it suitable for complex digital computations, signal processing, and networking tasks that require rapid data throughput and reliable performance under varying operational conditions.
XCKU11P-2FFVD900E Applications
- Data Centers: Utilized for data processing and storage solutions, enhancing server capabilities with accelerated hardware performance for cloud computing and big data analytics.
- Telecommunications: Employed in networking equipment, facilitating improved signal processing capabilities and higher bandwidth operations in routers and switchers.
- Medical Imaging: Integral in the development of medical devices that require high-speed image processing for diagnostics and advanced medical research.
- Automotive: Used in driver assistance systems (ADAS) and infotainment systems, providing the necessary computing power to handle real-time processing and multimedia tasks.
- Aerospace and Defense: Critical for applications in navigation systems and onboard computers, ensuring robust performance in extreme environmental conditions.
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