XCKU115-2FLVB1760I
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- Mfr.Part #
- XCKU115-2FLVB1760I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 702 I/O 1760FCBGA
- Stock
- 48,607
- In Stock ：
- 48,607
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- ECCN Code :
- 3A001.A.7.B
- Series :
- Kintex® UltraScale™
- Operating Supply Voltage :
- 950mV
- Factory Lead Time :
- 10 Weeks
- Packing Method :
- Tray
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Logic Elements/Cells :
- 1451100
- Number of Registers :
- 1.32672e+06
- Package / Case :
- 1760-BBGA, FCBGA
- RAM Size :
- 9.5MB
- Height Seated (Max) :
- 3.71mm
- RoHS Status :
- ROHS3 Compliant
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Mount :
- Surface Mount
- Supply Voltage :
- 0.95V
- Number of I/O :
- 702
- Terminal Form :
- Ball
- Power Supplies :
- 0.95V
- Qualification Status :
- Not Qualified
- JESD-609 Code :
- e1
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Position :
- BOTTOM
- Mounting Type :
- Surface Mount
- Number of Inputs :
- 702
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Contact Plating :
- Copper, Silver, Tin
- Number of Outputs :
- 702
- Number of LABs/CLBs :
- 82920
- Voltage - Supply :
- 0.922V~0.979V
- Total RAM Bits :
- 77721600
- JESD-30 Code :
- S-PBGA-B1760
- Terminal Pitch :
- 1mm
- Speed Grade :
- 2
- Operating Temperature :
- -40°C~100°C TJ
- Packaging :
- Bulk
- Published :
- 2012
- Datasheets
- XCKU115-2FLVB1760I
950mV V 3.71mm mm FPGAs Kintex® UltraScale™ Series 1760-BBGA, FCBGA 1mm mm
XCKU115-2FLVB1760I Overview
The package that contains this software is called 1760-BBGA, FCBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 702 I/Os for better data transfer. In order to construct a fundamental building block, 1451100 logic elements/cells are required. In order for the device to operate, a supply voltage of 0.95V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 0.922V~0.979V battery. There are many types of FPGAs in the Kintex® UltraScale™ series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. A device such as this one has 702 outputs built into it. Fpga chips is designed to maximiBulke space efficiency by containing the FPGA model in Bulk. As far as the RAM bits are concerned, this device offers you a total of 77721600. For the program to work properly, the RAM si9.5MBe of this FPGA module must reach 9.5MB GB in order to ensure normal operation. 82920 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 950mV supply voltage. In order for fpga electronics to work, fpga electronics requires a 0.95V power supply. In order to store and transfer data, a total of 1.32672e+06 registers are used. As a result, most industrial design purposes can be accommodated by its TRAY packing method.
XCKU115-2FLVB1760I Features
702 I/Os
Up to 77721600 RAM bits
1.32672e+06 registers
XCKU115-2FLVB1760I Applications
There are a lot of Xilinx Inc.
XCKU115-2FLVB1760I FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
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