XCKU115-2FLVB1760E
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- Mfr.Part #
- XCKU115-2FLVB1760E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 702 I/O 1760FCBGA
- Stock
- 21,133
- In Stock ：
- 21,133
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RoHS Status :
- ROHS3 Compliant
- Packing Method :
- Tray
- Power Supplies :
- 0.95V
- Height Seated (Max) :
- 3.71mm
- Factory Lead Time :
- 10 Weeks
- Number of Logic Elements/Cells :
- 1451100
- Surface Mount :
- yes
- Series :
- Kintex® UltraScale™
- Number of I/O :
- 702
- Number of Inputs :
- 702
- Number of LABs/CLBs :
- 82920
- JESD-30 Code :
- S-PBGA-B1760
- Terminal Form :
- Ball
- HTS Code :
- 8542.39.00.01
- Qualification Status :
- Not Qualified
- Packaging :
- Bulk
- Number of Outputs :
- 702
- Package / Case :
- 1760-BBGA, FCBGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- ECCN Code :
- 3A001.A.7.B
- Length :
- 42.5mm
- Supply Voltage :
- 0.95V
- Mounting Type :
- Surface Mount
- Width :
- 42.5mm
- JESD-609 Code :
- e1
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of CLBs :
- 5520
- Voltage - Supply :
- 0.922V~0.979V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Total RAM Bits :
- 77721600
- Terminal Pitch :
- 1mm
- Organization :
- 5520 CLBS
- Operating Temperature :
- 0°C~100°C TJ
- RAM Size :
- 9.5MB
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Published :
- 2012
- Datasheets
- XCKU115-2FLVB1760E
3.71mm mm FPGAs Kintex® UltraScale™ Series 1760-BBGA, FCBGA 1mm mm
XCKU115-2FLVB1760E Overview
A 1760-BBGA, FCBGA package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 702 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 1451100 logic elements/cells. An electrical supply voltage of 0.95V powers it. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 0.922V~0.979V supply voltage, fpga chips is able to operate at high speeds. The FPGA belongs to the Kintex® UltraScale™ series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~100°C TJ. In order to make this device as versatile as possible, there are 702 different outputs included. It is for space saving reasons that this FPGA model is contained in Bulk. The RAM bits that are offered by this fpga chips are 77721600. The FPGA module's RAM si9.5MBe reaches 9.5MB in order to ensure that the program operates in a normal manner. Fpga electronics contains 82920 LABs/CLBs in an array. Powered by a 0.95V power supply, it can be operated by almost anyone. In its architecture, there are 5520 CLB modules. Accordingly, fpga circuit adopts a packing method of TRAY to meet most industry design needs.
XCKU115-2FLVB1760E Features
702 I/Os
Up to 77721600 RAM bits
XCKU115-2FLVB1760E Applications
There are a lot of Xilinx Inc.
XCKU115-2FLVB1760E FPGAs applications.
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
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