XCKU095-2FFVC1517E
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- Mfr.Part #
- XCKU095-2FFVC1517E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 468 I/O 1517FCBGA
- Stock
- 11,188
- In Stock ：
- 11,188
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- Contact Plating :
- Copper, Silver, Tin
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Supply Voltage :
- 0.95V
- Power Supplies :
- 0.95V
- Published :
- 2012
- Speed Grade :
- 2
- Factory Lead Time :
- 10 Weeks
- Total RAM Bits :
- 60518400
- Number of I/O :
- 468
- Terminal Pitch :
- 1mm
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Tray
- JESD-609 Code :
- e1
- Organization :
- 768 CLBS
- Number of LABs/CLBs :
- 67200
- Number of CLBs :
- 768
- Package / Case :
- 1517-BBGA, FCBGA
- ECCN Code :
- 3A001.A.7.B
- Qualification Status :
- Not Qualified
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Inputs :
- 520
- Operating Supply Voltage :
- 950mV
- Voltage - Supply :
- 0.922V~0.979V
- Width :
- 40mm
- Series :
- Kintex® UltraScale™
- Number of Registers :
- 1.0752e+06
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Mounting Type :
- Surface Mount
- RAM Size :
- 7.2MB
- Height Seated (Max) :
- 4.09mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Mount :
- Surface Mount
- Number of Outputs :
- 520
- JESD-30 Code :
- S-PBGA-B1517
- Terminal Position :
- BOTTOM
- Number of Logic Elements/Cells :
- 1176000
- Operating Temperature :
- 0°C~100°C TJ
- Length :
- 40mm
- Datasheets
- XCKU095-2FFVC1517E
FPGAs AMD Xilinx XCKU095-2FFVC1517E Overview
The AMD Xilinx XCKU095-2FFVC1517E represents a pivotal advancement in the field of FPGA technology. Engineered to deliver high performance and flexibility, this FPGA from AMD Xilinx is tailored for developers who demand superior configurability and integration capabilities. Designed to tackle complex computational problems and accelerate applications, the XCKU095-2FFVC1517E is built in a compact 1517-pin FCBGA package and supports a robust 468 I/O interface, making it an ideal choice for high-density applications that require speed and reliability. This product's superior architecture enables efficient power management and thermal performance, which are critical in reducing system overhead and enhancing product lifespan.
XCKU095-2FFVC1517E Features
This FPGA features a highly flexible architecture that supports multiple configuration schemes, ensuring that it can be adapted to a wide range of applications. Its significant logic density and ample I/O pins make it well-suited for processing-intensive tasks. Additionally, the device benefits from Xilinx's advanced technology in security and data protection, making it a secure choice for applications requiring data integrity and encryption.
XCKU095-2FFVC1517E Applications
- Data Centers: The high I/O capacity and scalability make it perfect for managing intensive data operations and storage solutions, improving data throughput and system efficiency.
- Telecommunications: Utilized in telecommunications infrastructure to facilitate high-speed signal processing and network management, enhancing connectivity and network reliability.
- Automotive: Applied in advanced driver-assistance systems (ADAS) to process real-time sensor data and support safety-critical functions.
- Aerospace: Suitable for aerospace applications where high-level data processing and control are required for navigation and communication systems.
- Consumer Electronics: Helps in the development of consumer electronics by enabling sophisticated user interfaces and high-performance multimedia processing.
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