XCKU060-3FFVA1156E

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Mfr.Part #
XCKU060-3FFVA1156E
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 520 I/O 1156FCBGA
Stock
17,642
In Stock :
17,642

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Max Junction Temperature (Tj) :
100°C
Organization :
2760 CLBS
Operating Temperature :
0°C~100°C TJ
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Speed Grade :
3
Number of LABs/CLBs :
41460
Packing Method :
Tray
RAM Size :
4.8MB
Surface Mount :
yes
Number of Inputs :
520
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Qualification Status :
Not Qualified
Package / Case :
1156-BBGA, FCBGA
Power Supplies :
1V
JESD-30 Code :
S-PBGA-B1156
Number of Outputs :
520
Terminal Position :
BOTTOM
Total RAM Bits :
38912000
Number of I/O :
520
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
JESD-609 Code :
e1
Height :
3.51mm
Voltage - Supply :
0.970V~1.030V
Memory Type :
RAM
Packaging :
Bulk
Number of CLBs :
2760
Series :
Kintex® UltraScale™
Factory Lead Time :
10 Weeks
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Logic Elements/Cells :
725550
Published :
2012
Terminal Form :
Ball
Supply Voltage :
1V
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU060-3FFVA1156E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Package / Case:1156-BBGA, FCBGA, Mounting Type:Surface Mount, XCKU060-3FFVA1156E pinout, XCKU060-3FFVA1156E datasheet PDF, XCKU060-3FFVA1156E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU060-3FFVA1156E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU060-3FFVA1156E


FPGAs+AMD Xilinx+XCKU060-3FFVA1156E Overview

AMD Xilinx的XCKU060-3FFVA1156E是一款高性能FPGA(Field Programmable Gate Array),具有强大的可编程能力和多样的应用领域。这款1156引脚的FCBGA(Flip-Chip Ball Grid Array)封装使其在各种复杂设计和高性能计算环境中表现出色。通过520个I/O接口,XCKU060-3FFVA1156E能够支持复杂的连接需求,满足工业自动化、通信系统和嵌入式系统等多种应用场景的要求。它集成了高性能逻辑资源,适用于快速原型开发和高级算法实现。在通信、计算和工业控制领域,它能提供出色的灵活性和可扩展性,为大规模集成和定制设计提供了理想的解决方案。

XCKU060-3FFVA1156E Features

- **520 I/O接口**:提供广泛的连接和通信能力,支持多种外设和协议。 - **1156FCBGA封装**:紧凑型设计适用于高密度集成和高性能需求的应用场景。 - **可编程能力强**:支持复杂逻辑设计和高性能计算,满足各种定制化需求。 - **高性能计算资源**:适用于通信和嵌入式系统的高性能应用场景。

XCKU060-3FFVA1156E Applications

- **通信基础设施**:XCKU060-3FFVA1156E支持高速数据处理和灵活的接口,可用于构建先进的通信系统和网络设备。 - **工业自动化**:凭借其强大的可编程能力和高密度封装,该FPGA适用于复杂的工业控制和自动化系统。 - **嵌入式系统**:其520个I/O接口和高性能逻辑资源使其在嵌入式系统中表现出色,满足定制化和高效数据处理需求。 - **信号处理**:强大的计算能力和可编程特性使其成为信号处理和数据分析应用的理想选择。
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