XCKU040-3SFVA784E

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Mfr.Part #
XCKU040-3SFVA784E
Manufacturer
AMD Xilinx
Package / Case
784-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 468 I/O 784FCBGA
Stock
21,504
In Stock :
21,504

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
HTS Code :
8542.39.00.01
Qualification Status :
Not Qualified
Number of I/O :
468
Surface Mount :
yes
Voltage - Supply :
0.970V~1.030V
Organization :
1920 CLBS
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Length :
23mm
Published :
2012
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Pitch :
0.8mm
Height Seated (Max) :
3.52mm
Power Supplies :
1V
Terminal Position :
BOTTOM
Mounting Type :
Surface Mount
Supply Voltage :
1V
RoHS Status :
ROHS3 Compliant
Number of Inputs :
468
Number of Terminations :
784
Number of Outputs :
468
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Factory Lead Time :
10 Weeks
Number of CLBs :
1920
Packaging :
Bulk
Operating Temperature :
0°C~100°C TJ
Terminal Form :
Ball
Width :
23mm
Series :
Kintex® UltraScale™
Number of Logic Elements/Cells :
530250
JESD-30 Code :
S-PBGA-B784
ECCN Code :
3A991.D
Packing Method :
Tray
Package / Case :
784-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of LABs/CLBs :
30300
Total RAM Bits :
21606000
Datasheets
XCKU040-3SFVA784E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU040-3SFVA784E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:784, Operating Temperature:0°C~100°C TJ, Package / Case:784-BBGA, FCBGA, XCKU040-3SFVA784E pinout, XCKU040-3SFVA784E datasheet PDF, XCKU040-3SFVA784E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU040-3SFVA784E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU040-3SFVA784E


FPGAs AMD Xilinx XCKU040-3SFVA784E Overview

The FPGAs AMD Xilinx XCKU040-3SFVA784E is a highly advanced field programmable gate array (FPGA) designed to meet the increasing demands of high-performance, high-throughput applications. Manufactured by AMD Xilinx, this FPGA features a dense configuration of 784 flip-chip ball grid array (FCBGA) package, enabling robust integration in a variety of system architectures. With 468 I/O ports, this component offers exceptional flexibility and scalability, making it an ideal choice for developers looking to push the boundaries of technology in embedded systems. The XCKU040-3SFVA784E is crafted for efficiency and high-speed performance, ensuring that it can handle complex computations and data-intensive processes with ease.

XCKU040-3SFVA784E Features

This FPGA stands out with its robust package of features, including a high I/O count and a compact 784FCBGA configuration that ensures a reduced footprint while maximizing the performance. Its ability to be reprogrammed on the fly enhances its versatility, making it suitable for a wide range of applications, from advanced computing to digital signal processing.

XCKU040-3SFVA784E Applications

  • Data Centers: Utilized for accelerating computing tasks, handling complex algorithms and managing large datasets efficiently.
  • Telecommunications: Deployed in infrastructure to manage signal processing, network traffic control, and data routing with high reliability and low latency.
  • Automotive: Essential for advanced driver-assistance systems (ADAS) where it processes real-time inputs from vehicle sensors to aid in navigation and decision-making.
  • Industrial Automation: Applied in machinery control systems to perform real-time monitoring and control tasks, enhancing productivity and safety.
  • Consumer Electronics: Integrated in devices like smart TVs and gaming consoles to enhance graphical outputs and overall device responsiveness.
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