XCKU040-3FBVA900E
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- Mfr.Part #
- XCKU040-3FBVA900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 468 I/O 900FCBGA
- Stock
- 32,793
- In Stock ：
- 32,793
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Length :
- 31mm
- Number of Outputs :
- 468
- Terminal Position :
- BOTTOM
- Organization :
- 1920 CLBS
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Packaging :
- Tray
- Operating Temperature :
- 0°C~100°C TJ
- Package / Case :
- 900-BBGA, FCBGA
- RoHS Status :
- ROHS3 Compliant
- Series :
- Kintex® UltraScale™
- Width :
- 31mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Height Seated (Max) :
- 2.8mm
- JESD-30 Code :
- S-PBGA-B900
- HTS Code :
- 8542.39.00.01
- Terminal Pitch :
- 1mm
- Power Supplies :
- 1V
- Number of LABs/CLBs :
- 30300
- Published :
- 2013
- Qualification Status :
- Not Qualified
- Number of Terminations :
- 900
- Number of I/O :
- 468
- Terminal Form :
- Ball
- Number of Inputs :
- 468
- Voltage - Supply :
- 0.970V~1.030V
- JESD-609 Code :
- e1
- Total RAM Bits :
- 21606000
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Surface Mount :
- yes
- Factory Lead Time :
- 10 Weeks
- Number of CLBs :
- 1920
- Mounting Type :
- Surface Mount
- ECCN Code :
- 3A991.D
- Supply Voltage :
- 1V
- Number of Logic Elements/Cells :
- 530250
- Datasheets
- XCKU040-3FBVA900E
FPGAs AMD Xilinx XCKU040-3FBVA900E Overview
The FPGAs AMD Xilinx XCKU040-3FBVA900E represents a highly advanced field-programmable gate array designed to meet the demanding needs of modern electronic systems. This component, crafted by AMD Xilinx, a leader in digital design innovation, integrates powerful features into a compact 900FCBGA (Fine Pitch Ball Grid Array) package, allowing for robust performance in a variety of applications. With its substantial array of 468 I/Os, this FPGA is capable of handling complex, high-speed interfacing which makes it an ideal choice for developers looking to push the limits of data processing, storage, and signal management in next-generation electronics.
XCKU040-3FBVA900E Features
This FPGA is engineered with precision, incorporating numerous features that enhance its usability and efficiency in sophisticated digital environments. Key features include a high count of input/output ports that provide flexible connectivity options, a dense 900-ball FCBGA package that minimizes the footprint on system boards, and advanced heat dissipation capabilities that ensure stable operation under load. This device also supports a wide range of programming and integration tools provided by AMD Xilinx, which facilitates ease of design and implementation in complex projects.
XCKU040-3FBVA900E Applications
- Telecommunications: Utilized in routers and switches, the XCKU040-3FBVA900E enhances data flow management and signal integrity, crucial for maintaining high-speed network performance and reliability.
- Data Centers: Serves as a core component in data storage systems, enabling high-throughput data processing and efficient power management, which are vital for modern data center operations.
- Medical Imaging: Applied in advanced diagnostic equipment, such as MRI and CT scanners, where its processing power helps to manage and enhance image resolution and scanning speeds.
- Automotive: Integrated into driver assistance systems (ADAS), this FPGA improves vehicle sensor data processing capabilities, contributing to safer and smarter vehicle operation.
- Aerospace and Defense: Employed in satellite communications systems, the XCKU040-3FBVA900E supports complex algorithms required for secure communications and navigation systems in challenging environments.
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