XCKU040-3FBVA676E
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- Mfr.Part #
- XCKU040-3FBVA676E
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 312 I/O 676FCBGA
- Stock
- 4,402
- In Stock ：
- 4,402
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 530250
- Width :
- 27mm
- Operating Supply Voltage :
- 950mV
- RoHS Status :
- ROHS3 Compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Package / Case :
- 676-BBGA, FCBGA
- Number of I/O :
- 312
- Number of Terminations :
- 676
- Mount :
- Surface Mount
- Series :
- Kintex® UltraScale™
- Contact Plating :
- Copper, Silver, Tin
- Height Seated (Max) :
- 2.71mm
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of LABs/CLBs :
- 30300
- Supply Voltage :
- 1V
- Number of Registers :
- 484800
- Operating Temperature :
- 0°C~100°C TJ
- Terminal Position :
- BOTTOM
- Published :
- 2012
- Organization :
- 1920 CLBS
- Packaging :
- Bulk
- Qualification Status :
- Not Qualified
- JESD-609 Code :
- e1
- Voltage - Supply :
- 0.970V~1.030V
- Terminal Form :
- Ball
- RAM Size :
- 2.6MB
- Terminal Pitch :
- 1mm
- Speed Grade :
- 3
- Number of Outputs :
- 312
- Number of CLBs :
- 1920
- Total RAM Bits :
- 21606000
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Factory Lead Time :
- 10 Weeks
- Number of Pins :
- 676
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Length :
- 27mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Packing Method :
- Tray
- Power Supplies :
- 1V
- Datasheets
- XCKU040-3FBVA676E
FPGAs AMD Xilinx XCKU040-3FBVA676E Overview
The FPGAs AMD Xilinx XCKU040-3FBVA676E is a highly capable field programmable gate array (FPGA) that stands out in the AMD Xilinx portfolio. Designed to cater to a vast array of complex digital computations, this integrated circuit combines flexibility with high-performance capabilities. Its compact 676-pin flip-chip ball grid array (FCBGA) package ensures a minimal footprint, making it ideal for space-constrained applications. The XCKU040-3FBVA676E is especially suited for developers and engineers looking to push the boundaries of technology in both industrial and commercial applications. Its robust configuration allows for rapid prototyping and scaling of sophisticated systems, supporting a wide range of uses from advanced computing to signal processing.
XCKU040-3FBVA676E Features
This FPGA features 312 user I/O pins, providing ample flexibility for interfacing with other components in complex systems. The high I/O count is complemented by advanced memory and logic capabilities, which are essential for handling intricate algorithms and processes in real-time applications. The device is built on AMD Xilinx's leading-edge technology, ensuring reliability and high performance under demanding conditions.
XCKU040-3FBVA676E Applications
- Data Centers: Utilized in server farms to accelerate data processing tasks, improving efficiency and throughput in cloud computing environments.
- Telecommunications: Plays a crucial role in signal processing equipment, supporting high-speed data transmission and reception for enhanced network capabilities.
- Automotive Technology: Integrated into driver assistance systems to process real-time sensor data, enhancing vehicle safety and performance.
- Medical Devices: Used in medical imaging systems, such as MRI and ultrasound equipment, for fast and accurate image processing to assist in diagnostics.
- Industrial Automation: Applied in automated machinery and robotics to control and optimize manufacturing processes, increasing precision and productivity.
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