XCKU040-2FBVA676E

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Mfr.Part #
XCKU040-2FBVA676E
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 312 I/O 676FCBGA
Stock
33,792
In Stock :
33,792

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
0.922V~0.979V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Power Supplies :
0.95V
RoHS Status :
ROHS3 Compliant
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
676-BBGA, FCBGA
Organization :
1920 CLBS
Terminal Form :
Ball
Terminal Pitch :
1mm
JESD-609 Code :
e1
Mounting Type :
Surface Mount
ECCN Code :
3A991.D
Number of Logic Elements/Cells :
530250
Number of I/O :
312
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Number of LABs/CLBs :
30300
Supply Voltage :
0.95V
Packaging :
Tray
HTS Code :
8542.39.00.01
Number of Outputs :
312
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Published :
2012
Number of Terminations :
676
Factory Lead Time :
10 Weeks
Number of CLBs :
1920
Mount :
Surface Mount
Series :
Kintex® UltraScale™
RAM Size :
2.6MB
Qualification Status :
Not Qualified
Terminal Position :
BOTTOM
JESD-30 Code :
S-PBGA-B676
Operating Temperature :
0°C~100°C TJ
Length :
27mm
Height Seated (Max) :
2.71mm
Total RAM Bits :
21606000
Number of Inputs :
312
Width :
27mm
Datasheets
XCKU040-2FBVA676E
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU040-2FBVA676E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BBGA, FCBGA, Mounting Type:Surface Mount, Number of Terminations:676, Operating Temperature:0°C~100°C TJ, XCKU040-2FBVA676E pinout, XCKU040-2FBVA676E datasheet PDF, XCKU040-2FBVA676E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU040-2FBVA676E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU040-2FBVA676E


FPGAs AMD Xilinx XCKU040-2FBVA676E Overview

The FPGAs AMD Xilinx XCKU040-2FBVA676E represents a highly versatile and powerful FPGA (Field Programmable Gate Array) solution, engineered by AMD Xilinx, one of the leaders in digital design and fabrication. Designed to meet the demanding needs of modern digital circuits, this IC (Integrated Circuit) is encased in a 676-pin FCBGA (Flip-Chip Ball Grid Array) package, offering a robust platform for developing complex hardware in networking, automotive, and aerospace industries. With its extensive I/O capabilities and high-performance attributes, the XCKU040-2FBVA676E is an ideal choice for designers looking to leverage speed and flexibility while maintaining power efficiency in their digital computation and processing tasks.

XCKU040-2FBVA676E Features

This FPGA module boasts 312 I/O ports which facilitate extensive connectivity and adaptability across various applications. The high-density pin configuration within a compact 676FCBGA package ensures that it can handle multiple inputs and outputs without sacrificing performance. This module is tailored for advanced system designs requiring high-speed data processing and real-time performance optimizations.

XCKU040-2FBVA676E Applications

  • Telecommunications Equipment: Utilized in routers and switches for managing data traffic efficiently.
  • Automotive Driver Assistance Systems: Serves as the processing core for sensors and cameras in advanced driver-assistance systems (ADAS), enhancing vehicle safety and performance.
  • Data Center Solutions: Ideal for data encryption and server load balancing applications in modern data centers, ensuring secure and efficient data handling.
  • Consumer Electronics: Acts as a flexible platform for high-resolution video processing in devices such as digital cameras and virtual reality systems.
  • Industrial Automation: Employs in control systems for real-time processing of data from various sensors and actuators, improving automation and efficiency.
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