XCKU040-1FBVA900C

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Mfr.Part #
XCKU040-1FBVA900C
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 468 I/O 900FCBGA
Stock
37,365
In Stock :
37,365

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
900-BBGA, FCBGA
RoHS Status :
ROHS3 Compliant
Operating Temperature :
0°C~85°C TJ
Total RAM Bits :
21606000
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Logic Elements/Cells :
530250
JESD-609 Code :
e1
Operating Supply Voltage :
950mV
Number of Terminations :
900
Supply Voltage :
0.95V
Packing Method :
Tray
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Factory Lead Time :
10 Weeks
Number of LABs/CLBs :
30300
Mounting Type :
Surface Mount
Terminal Form :
Ball
RAM Size :
2.6MB
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Number of I/O :
468
Height Seated (Max) :
2.8mm
Packaging :
Bulk
Published :
2011
Terminal Position :
BOTTOM
Surface Mount :
yes
Power Supplies :
0.95V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of Registers :
484800
Number of Outputs :
468
Series :
Kintex® UltraScale™
Voltage - Supply :
0.922V~0.979V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Speed Grade :
1
Number of Pins :
900
Qualification Status :
Not Qualified
Datasheets
XCKU040-1FBVA900C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU040-1FBVA900C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:900-BBGA, FCBGA, Operating Temperature:0°C~85°C TJ, Number of Terminations:900, Mounting Type:Surface Mount, Number of Pins:900, XCKU040-1FBVA900C pinout, XCKU040-1FBVA900C datasheet PDF, XCKU040-1FBVA900C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XCKU040-1FBVA900C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCKU040-1FBVA900C


FPGAs AMD Xilinx XCKU040-1FBVA900C Overview

The AMD Xilinx XCKU040-1FBVA900C FPGA is a highly versatile and powerful component designed for applications requiring high-speed data processing and flexible hardware configurations. This FPGA integrates advanced features into a compact 900FCBGA package, making it an ideal choice for developers looking to push the limits of system performance and integration. The XCKU040-1FBVA900C is engineered to deliver exceptional performance efficiency, benefiting from AMD Xilinx's leading-edge technology in programmable logic solutions. Its robust I/O capabilities make it suitable for a wide range of industrial, communication, and technology applications, ensuring that it meets the needs of the most demanding tasks.

XCKU040-1FBVA900C Features

The XCKU040-1FBVA900C FPGA from AMD Xilinx features 468 input/output ports which provide substantial flexibility in system design. This product is housed in a 900-pin flip-chip ball grid array (FCBGA) package that facilitates efficient thermal management and compact integration into various hardware environments. The device's high-performance logic cells enable advanced digital computations, making it suitable for high-throughput applications.

XCKU040-1FBVA900C Applications

  • Data Centers: Utilizes its high I/O count and processing power to manage complex operations and data flows, enhancing server capabilities and network infrastructure.
  • Telecommunications: Serves as a core component in telecom equipment, managing signal processing and control tasks to improve network efficiency and reliability.
  • Medical Imaging: Provides the processing power necessary for high-resolution medical imaging devices, enabling faster and more accurate diagnostics.
  • Automotive: Enhances functionality in advanced driver-assistance systems (ADAS), supporting real-time processing for vehicle safety and navigation systems.
  • Industrial Automation: Capable of handling complex control systems in manufacturing processes, increasing precision and productivity in industrial settings.
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