XCKU035-3FBVA900E
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- Mfr.Part #
- XCKU035-3FBVA900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 468 I/O 900FCBGA
- Stock
- 34,035
- In Stock ：
- 34,035
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- JESD-30 Code :
- S-PBGA-B900
- Packing Method :
- Tray
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Surface Mount :
- yes
- Length :
- 31mm
- Height Seated (Max) :
- 2.8mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Mounting Type :
- Surface Mount
- Series :
- Kintex® UltraScale™
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Form :
- Ball
- Number of Terminations :
- 900
- Power Supplies :
- 1V
- Width :
- 31mm
- Number of LABs/CLBs :
- 25391
- Factory Lead Time :
- 10 Weeks
- RoHS Status :
- ROHS3 Compliant
- Terminal Pitch :
- 1mm
- Number of I/O :
- 468
- Total RAM Bits :
- 19456000
- HTS Code :
- 8542.39.00.01
- Operating Temperature :
- 0°C~100°C TJ
- Number of CLBs :
- 1700
- Qualification Status :
- Not Qualified
- Number of Logic Elements/Cells :
- 444343
- Number of Outputs :
- 468
- Published :
- 2012
- Package / Case :
- 900-BBGA, FCBGA
- Voltage - Supply :
- 0.970V~1.030V
- ECCN Code :
- 3A991.D
- Packaging :
- Bulk
- Terminal Position :
- BOTTOM
- Organization :
- 1700 CLBS
- JESD-609 Code :
- e1
- Number of Inputs :
- 468
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Supply Voltage :
- 1V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- XCKU035-3FBVA900E
FPGAs AMD Xilinx XCKU035-3FBVA900E Overview
The AMD Xilinx XCKU035-3FBVA900E FPGA is a highly capable component designed for advanced digital circuitry tasks in high-tech sectors. Engineered by AMD Xilinx, a leader in programmable logic solutions, this FPGA offers an optimal mix of power, flexibility, and performance. Enclosed in a 900-pin FCBGA package, it features a robust interface capable of handling 468 I/Os, making it highly versatile for a range of complex applications. Its design and capabilities make it an essential choice for developers looking to push the boundaries of hardware acceleration and digital processing.
XCKU035-3FBVA900E Features
This FPGA model boasts several key features that enhance its performance and usability in demanding applications. Key attributes include its 900FCBGA packaging that ensures a compact form factor while providing ample pinout for extensive interfacing. The device's high I/O count supports complex, multi-layered designs. Enhanced with AMD Xilinx’s leading-edge technology, it offers excellent speed grades and adaptability, suitable for both prototyping and full-scale deployment.
XCKU035-3FBVA900E Applications
- Data Centers: Utilized in server infrastructure to manage data flow and accelerate processing tasks, improving efficiency and energy consumption.
- Telecommunications: Critical in the development of communication equipment, aiding in signal processing and network traffic management.
- Automotive: Integrated into automotive systems for advanced driver-assistance systems (ADAS), providing real-time processing capabilities that enhance vehicle safety and functionality.
- Medical Imaging: Applied in medical imaging equipment, such as MRI and CT scanners, to enhance image processing speeds and diagnostic accuracy.
- Consumer Electronics: Used in consumer electronics to enhance multimedia processing and user interfaces in devices like smart TVs and advanced gaming consoles.
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