XCKU035-2FFVA1156E
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- Mfr.Part #
- XCKU035-2FFVA1156E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 520 I/O 1156FCBGA
- Stock
- 990
- In Stock ：
- 990
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Speed Grade :
- 2
- Mounting Type :
- Surface Mount
- Operating Supply Voltage :
- 950mV
- Length :
- 35mm
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Outputs :
- 520
- Number of CLBs :
- 1700
- Packaging :
- Bulk
- Supply Voltage :
- 0.95V
- Height Seated (Max) :
- 3.51mm
- Packing Method :
- Tray
- Qualification Status :
- Not Qualified
- Operating Temperature :
- 0°C~100°C TJ
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Package / Case :
- 1156-BBGA, FCBGA
- Factory Lead Time :
- 10 Weeks
- Mount :
- Surface Mount
- Number of LABs/CLBs :
- 25391
- RAM Size :
- 2.4MB
- Number of Inputs :
- 520
- Terminal Position :
- BOTTOM
- Number of I/O :
- 520
- Terminal Pitch :
- 1mm
- RoHS Status :
- ROHS3 Compliant
- ECCN Code :
- 3A991.D
- Voltage - Supply :
- 0.922V~0.979V
- Organization :
- 1700 CLBS
- Terminal Form :
- Ball
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- JESD-30 Code :
- S-PBGA-B1156
- Contact Plating :
- Copper, Silver, Tin
- Number of Registers :
- 406256
- Published :
- 2012
- Number of Logic Elements/Cells :
- 444343
- Width :
- 35mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Total RAM Bits :
- 19456000
- JESD-609 Code :
- e1
- Power Supplies :
- 0.95V
- Series :
- Kintex® UltraScale™
- Datasheets
- XCKU035-2FFVA1156E
FPGAs AMD Xilinx XCKU035-2FFVA1156E Overview
The AMD Xilinx XCKU035-2FFVA1156E FPGA offers a high-density, feature-rich platform ideal for a wide range of applications. This device, part of the renowned UltraScale series, is engineered to deliver exceptional performance and flexibility with its advanced technology. It integrates multiple functionalities in a single chip, making it an excellent choice for designers looking to optimize their systems for both performance and cost. Its robust 1156-pin FCBGA (flip-chip ball grid array) packaging ensures reliable connectivity and heat dissipation, making it suitable for complex digital processing tasks in demanding environments.
XCKU035-2FFVA1156E Features
The XCKU035-2FFVA1156E is equipped with 520 I/O ports, providing extensive interfacing capabilities. This allows for versatile design configurations in high-speed communication and control applications. The FPGA's architecture is optimized for efficient logic integration, facilitating improvements in signal processing and data throughput which are critical in today's technology-driven markets. The reliability and advanced capabilities of the XCKU035-2FFVA1156E make it an ideal choice for developers needing a scalable and powerful component.
XCKU035-2FFVA1156E Applications
- Data Centers: Utilized for managing high volumes of data and complex processing algorithms, enhancing operational efficiency and data handling capabilities.
- Telecommunications: Ideal for processing and routing large amounts of data with its extensive I/O capabilities, ensuring reliable communication networks.
- Automotive: Suitable for driver assistance systems where real-time data processing is critical for vehicle safety and performance.
- Industrial Automation: Helps in the control and monitoring of automated machinery, increasing productivity and reliability in manufacturing processes.
- Medical Devices: Used in medical imaging systems to handle intricate image processing tasks, improving diagnostic capabilities and patient outcomes.
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