XC7Z100-L2FFG900I
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- Mfr.Part #
- XC7Z100-L2FFG900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 900FCBGA
- Stock
- 9,691
- In Stock ：
- 9,691
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Height Seated (Max) :
- 3.35mm
- Terminal Pitch :
- 1mm
- Number of Registers :
- 554800
- Published :
- 2010
- Turn On Delay Time :
- 120 ps
- Peak Reflow Temperature (Cel) :
- 245
- Length :
- 31mm
- Peripherals :
- DMA
- RoHS Status :
- ROHS3 Compliant
- JESD-609 Code :
- e1
- Primary Attributes :
- Kintex™-7 FPGA, 444K Logic Cells
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of Pins :
- 900
- Max Supply Voltage :
- 1.05V
- RAM Size :
- 256KB
- HTS Code :
- 8542.39.00.01
- Min Supply Voltage :
- 950mV
- Boundary Scan :
- yes
- ECCN Code :
- 3A991.D
- Package / Case :
- 900-BBGA, FCBGA
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Mount :
- Surface Mount
- Operating Temperature :
- -40°C~100°C TJ
- Factory Lead Time :
- 10 Weeks
- Supply Voltage :
- 1V
- Core Architecture :
- ARM
- Terminal Form :
- Ball
- Width :
- 31mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Frequency :
- 800MHz
- RAM (words) :
- 256000
- Series :
- Zynq®-7000
- Contact Plating :
- Copper, Silver, Tin
- Packaging :
- Tray
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Propagation Delay :
- 120 ps
- Architecture :
- MCU, FPGA
- Number of Terminations :
- 900
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Number of I/O :
- 130
- Datasheets
- XC7Z100-L2FFG900I
900 Terminations -40°C~100°C TJ 900 Pin System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq®-7000 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Kintex™-7 FPGA, 444K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.There are 900 terminations in total and that really benefits system on a chip.The wireless SoC works at a frequency of 800MHz.The SoC meaning is based on the core architecture of ARM.Additionally, this SoC processor features PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.This is the 900-pin version of the computer SoC.It is rated with 1.05V maximum supply voltage.It is supplied with at least 950mV power.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z100-L2FFG900I System On Chip (SoC) applications.
- Automotive gateway
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
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