XC7Z010-1CLG225I
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- Mfr.Part #
- XC7Z010-1CLG225I
- Manufacturer
- AMD Xilinx
- Package / Case
- 225-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 225BGA
- Stock
- 530
- In Stock ：
- 530
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- ECCN Code :
- EAR99
- Terminal Form :
- Ball
- Series :
- Zynq®-7000
- Surface Mount :
- yes
- Architecture :
- MCU, FPGA
- Speed Grade :
- -1
- Package / Case :
- 225-LFBGA, CSPBGA
- JESD-609 Code :
- e1
- Primary Attributes :
- Artix™-7 FPGA, 28K Logic Cells
- Length :
- 13mm
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Terminal Pitch :
- 0.8mm
- Height Seated (Max) :
- 1.5mm
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Terminal Position :
- BOTTOM
- Base Part Number :
- XC7Z010
- RAM Size :
- 256KB
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Contact Plating :
- Copper, Silver, Tin
- Supply Voltage :
- 1V
- Frequency :
- 667MHz
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Radiation Hardening :
- No
- Packaging :
- Tray
- Number of Pins :
- 225
- Factory Lead Time :
- 10 Weeks
- HTS Code :
- 8542.39.00.01
- Number of Terminations :
- 225
- Data Bus Width :
- 32b
- RoHS Status :
- ROHS3 Compliant
- Peripherals :
- DMA
- Published :
- 2010
- Peak Reflow Temperature (Cel) :
- 260
- Operating Supply Voltage :
- 1V
- Number of I/O :
- 86
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Temperature :
- -40°C~100°C TJ
- RAM (words) :
- 256000
- Core Architecture :
- ARM
- Supply Voltage-Max (Vsup) :
- 1.05V
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Boundary Scan :
- yes
- Datasheets
- XC7Z010-1CLG225I
225 Terminations -40°C~100°C TJ 225 Pin XC7Z010 System On Chip Zynq®-7000 Series 86 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 225-LFBGA, CSPBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq®-7000 series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Artix™-7 FPGA, 28K Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 86 I/Os.For safe operation, it is advisable to utilize a power supply with 1V voltage.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.The system on a chip uses 225 terminations in total.By searching XC7Z010, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 667MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.In this computer SoC, there are 225 pins.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z010-1CLG225I System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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