XC7Z010-2CLG225I
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- Mfr.Part #
- XC7Z010-2CLG225I
- Manufacturer
- AMD Xilinx
- Package / Case
- 225-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 766MHZ 225BGA
- Stock
- 2
- In Stock ：
- 2
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- ECCN Code :
- EAR99
- Frequency :
- 766MHz
- Supply Voltage :
- 1V
- Supply Voltage-Max (Vsup) :
- 1.05V
- JESD-609 Code :
- e1
- Base Part Number :
- XC7Z010
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Number of Terminations :
- 225
- Surface Mount :
- yes
- Packaging :
- Tray
- Number of Pins :
- 225
- Core Architecture :
- ARM
- Radiation Hardening :
- No
- Length :
- 13mm
- Terminal Form :
- Ball
- Contact Plating :
- Copper, Silver, Tin
- Series :
- Zynq®-7000
- Speed Grade :
- -2
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- RAM Size :
- 256KB
- Peripherals :
- DMA
- RAM (words) :
- 256000
- Data Bus Width :
- 32b
- Published :
- 2010
- Terminal Pitch :
- 0.8mm
- HTS Code :
- 8542.39.00.01
- Primary Attributes :
- Artix™-7 FPGA, 28K Logic Cells
- Factory Lead Time :
- 10 Weeks
- Package / Case :
- 225-LFBGA, CSPBGA
- Height Seated (Max) :
- 1.5mm
- RoHS Status :
- ROHS3 Compliant
- Boundary Scan :
- yes
- REACH SVHC :
- No SVHC
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Number of I/O :
- 86
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Peak Reflow Temperature (Cel) :
- 260
- Operating Supply Voltage :
- 1V
- Architecture :
- MCU, FPGA
- Terminal Position :
- BOTTOM
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Operating Temperature :
- -40°C~100°C TJ
- Datasheets
- XC7Z010-2CLG225I
225 Terminations -40°C~100°C TJ 225 Pin XC7Z010 System On Chip Zynq®-7000 Series 86 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
There are Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processors in this SoC.This system on a chip is packaged as 225-LFBGA, CSPBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq®-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Artix™-7 FPGA, 28K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 86 I/Os.A power supply with a 1V rating is recommended.There is no safe voltage for the SoCs wireless above 1.05V.It is really beneficial to have system on a chip since there are 225 terminations in total.By searching XC7Z010, you can find system on chips with similar specs and purposes.There is 766MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.225 pins are present on this computer SoC.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z010-2CLG225I System On Chip (SoC) applications.
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
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