XC7Z100-L2FFG1156I

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Mfr.Part #
XC7Z100-L2FFG1156I
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A9 800MHZ 1156BGA
Stock
1,289
In Stock :
1,289

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Terminal Pitch :
1mm
Bus Compatibility :
CAN; ETHERNET; I2C; SPI; UART; USB
Turn On Delay Time :
120 ps
RAM Size :
256KB
ECCN Code :
3A991.D
Core Architecture :
ARM
Height Seated (Max) :
3.1mm
Number of Registers :
554800
Mount :
Surface Mount
Length :
35mm
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Pins :
1156
Architecture :
MCU, FPGA
Primary Attributes :
Kintex™-7 FPGA, 444K Logic Cells
Series :
Zynq®-7000
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Interface :
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RoHS Status :
ROHS3 Compliant
HTS Code :
8542.39.00.01
Max Supply Voltage :
1.05V
RAM (words) :
256000
Terminal Position :
BOTTOM
Supply Voltage :
1V
Additional Feature :
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Package / Case :
1156-BBGA, FCBGA
Frequency :
800MHz
Operating Temperature :
-40°C~100°C TJ
Boundary Scan :
yes
Factory Lead Time :
10 Weeks
Packaging :
Tray
Peripherals :
DMA
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Published :
2010
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Min Supply Voltage :
950mV
Propagation Delay :
120 ps
Width :
35mm
Core Processor :
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
JESD-609 Code :
e1
Terminal Form :
Ball
Number of I/O :
130
Contact Plating :
Copper, Silver, Tin
Introducing System On Chip (SoC) AMD Xilinx XC7Z100-L2FFG1156I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:1156, Package / Case:1156-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, XC7Z100-L2FFG1156I pinout, XC7Z100-L2FFG1156I datasheet PDF, XC7Z100-L2FFG1156I amp .Beyond System On Chip (SoC) AMD Xilinx XC7Z100-L2FFG1156I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7Z100-L2FFG1156I


-40°C~100°C TJ 1156 Pin System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 1156-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex™-7 FPGA, 444K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.At 800MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.The computer SoC is the 1156-pin version.There is a maximum supply voltage of 1.05V.A minimum of 950mV are supplied to it.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY


There are a lot of Xilinx Inc.


XC7Z100-L2FFG1156I System On Chip (SoC) applications.


  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
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