XC7Z100-L2FFG1156I
- Mfr.Part #
- XC7Z100-L2FFG1156I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 1156BGA
- Stock
- 1,289
- In Stock :
- 1,289
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Terminal Pitch :
- 1mm
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Turn On Delay Time :
- 120 ps
- RAM Size :
- 256KB
- ECCN Code :
- 3A991.D
- Core Architecture :
- ARM
- Height Seated (Max) :
- 3.1mm
- Number of Registers :
- 554800
- Mount :
- Surface Mount
- Length :
- 35mm
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Pins :
- 1156
- Architecture :
- MCU, FPGA
- Primary Attributes :
- Kintex™-7 FPGA, 444K Logic Cells
- Series :
- Zynq®-7000
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- RoHS Status :
- ROHS3 Compliant
- HTS Code :
- 8542.39.00.01
- Max Supply Voltage :
- 1.05V
- RAM (words) :
- 256000
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 1V
- Additional Feature :
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Package / Case :
- 1156-BBGA, FCBGA
- Frequency :
- 800MHz
- Operating Temperature :
- -40°C~100°C TJ
- Boundary Scan :
- yes
- Factory Lead Time :
- 10 Weeks
- Packaging :
- Tray
- Peripherals :
- DMA
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Published :
- 2010
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Min Supply Voltage :
- 950mV
- Propagation Delay :
- 120 ps
- Width :
- 35mm
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- JESD-609 Code :
- e1
- Terminal Form :
- Ball
- Number of I/O :
- 130
- Contact Plating :
- Copper, Silver, Tin
- Datasheets
- XC7Z100-L2FFG1156I
-40°C~100°C TJ 1156 Pin System On Chip Zynq®-7000 Series 130 I/O 1V Min 950mV V Max 1.05V V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 1156-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq®-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex™-7 FPGA, 444K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.Use a power supply with a voltage of 1V if possible.At 800MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.The computer SoC is the 1156-pin version.There is a maximum supply voltage of 1.05V.A minimum of 950mV are supplied to it.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z100-L2FFG1156I System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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