XC7Z100-2FFG1156I
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- Mfr.Part #
- XC7Z100-2FFG1156I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 800MHZ 1156BGA
- Stock
- 34
- In Stock ：
- 34
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Operating Temperature :
- -40°C~100°C TJ
- Interface :
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Supply Voltage :
- 1V
- Series :
- Zynq®-7000
- Height Seated (Max) :
- 3.1mm
- Supply Voltage-Min (Vsup) :
- 0.95V
- Factory Lead Time :
- 10 Weeks
- Packaging :
- Tray
- Frequency :
- 800MHz
- ECCN Code :
- 3A991.D
- Core Architecture :
- ARM
- RAM Size :
- 256KB
- Contact Plating :
- Copper, Silver, Tin
- Length :
- 35mm
- Data Bus Width :
- 32b
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Form :
- Ball
- Primary Attributes :
- Kintex™-7 FPGA, 444K Logic Cells
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Terminal Pitch :
- 1mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Position :
- BOTTOM
- Package / Case :
- 1156-BBGA, FCBGA
- JESD-609 Code :
- e1
- Supply Voltage-Max (Vsup) :
- 1.05V
- Peak Reflow Temperature (Cel) :
- 245
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Peripherals :
- DMA
- Core Processor :
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Published :
- 2010
- Mount :
- Surface Mount
- HTS Code :
- 8542.39.00.01
- Architecture :
- MCU, FPGA
- RAM (words) :
- 256000
- Reach Compliance Code :
- not_compliant
- Number of I/O :
- 250
- RoHS Status :
- ROHS3 Compliant
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- JESD-30 Code :
- S-PBGA-B1156
- Boundary Scan :
- yes
- Datasheets
- XC7Z100-2FFG1156I
-40°C~100°C TJ System On Chip Zynq®-7000 Series 250 I/O 1V
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 1156-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq®-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Kintex™-7 FPGA, 444K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.250 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.If it has at least a 0.95V volt power supply, it can work fine.A frequency of 800MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z100-2FFG1156I System On Chip (SoC) applications.
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
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